
Applications:
Electronics Cooling: Used to cool components like CPU, CPU, LED drivers, power supplies, and power transistors.
Automotive: In electric vehicles or power electronics for thermal management.
Industrial: Cooling systems in machinery and equipment that require heat dissipation.
Telecommunication: Cooling for telecom components or equipment exposed to heat.
Common Uses:
Computer hardware: CPU or GPU cooling.
LED lighting: Cooling LED drivers or power modules.
Power electronics: Managing heat in power transistors, converters, or inverters.
Telecom: Managing the heat of telecom equipment exposed to high operational loads
Product Parameter
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2. Tolerance: ± 0. 01 - ± 0.1mm
3. Certificate: ISO 9001
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Description | Product Attribute |
Manufacturer | Wanda-an |
Product Category | Heat Sinks |
Product | Heat Sinks |
Designed for | Solid State Relay - SSR |
Mounting Style | DIN Rail |
Heatsink Material | Aluminum |
Fin Style | Extruded Axial Fin |
Thermal Resistance | 1.2 C/W |
Length | 90 mm |
Width | 81 mm |
Height | 80 mm |
Color | Black |
Packaging | Each |
Product Type | Heat Sinks |
Series | HS |
Subcategory | Heat Sinks |
1. Fin Type Heat Sink
Description: This is the most common and traditional type. It consists of flat metal fins that are arranged in parallel or staggered patterns to increase the surface area for heat dissipation.
Application: Used in many electronics, computers, and power devices where space is not too restrictive.
Types of Fin Configurations:
Straight Fin: Simple parallel fins, typically used in standard applications.
Staggered Fin: Fins are slightly offset, increasing surface area and airflow efficiency.
Radial Fin: Fins radiate outward in a circular pattern, typically used for compact, cylindrical devices.
2. Pin Fin Heat Sink
Description: These heat sinks have a series of cylindrical pins (instead of flat fins) to increase surface area. The pins can be arranged in a grid or random pattern, and this design enhances airflow between the pins.
Application: Commonly used when airflow is limited or in situations where small spaces require high surface area.
Benefits: Great for environments where air circulation is not optimal, as the pins allow for better heat dissipation through natural convection.
3. Plate Type Heat Sink
Description: A simple flat plate made from a thermally conductive material like aluminum. Heat is transferred across the surface, and fins or pins can be added to the plate for enhanced heat dissipation.
Application: Typically used in low-power electronics or when space and weight are not major concerns.
Benefits: Simple and cost-effective design.
4. Heat Pipe Heat Sink
Description: Heat pipes are used within the heat sink to transfer heat from one point to another with very high efficiency. The heat pipe contains a liquid that evaporates at the hot end and condenses at the cooler end, transferring thermal energy along the length of the pipe.
Application: Used in high-performance computing, graphics cards, and laptops where efficient thermal management is critical.
Benefits: Efficient for cooling small devices that generate significant heat and for applications where space is limited.
5. Vapor Chamber Heat Sink
Description: Similar to a heat pipe, but instead of using a single pipe, a vapor chamber uses a flat, sealed enclosure containing a small amount of fluid. The fluid evaporates at the hot end and condenses at the cooler end, transferring heat effectively.
Application: Often used in high-end processors, servers, and gaming laptops to ensure better uniformity in heat distribution.
Benefits: Provides efficient cooling over a larger area, especially in situations with dense heat generation.
6. Active Heat Sink
Description: These heat sinks incorporate a fan or other active cooling method to force air over the heat sink surface, increasing heat dissipation. The fan is typically mounted on top of or integrated into the heat sink.
Application: Found in applications where passive cooling (using only natural convection) is not sufficient. Examples include computer CPUs, graphics cards, power electronics, and servers.
Benefits: Significantly increases heat dissipation capacity but adds complexity and noise.
7. Passive Heat Sink
Description: A passive heat sink relies entirely on natural convection (without any active cooling like fans). It uses a combination of large surface area and heat conduction to dissipate heat into the surrounding air.
Application: Used in quieter environments, or when energy consumption and space are a concern. Examples include low-power electronics and industrial machinery.
Benefits: Simple, reliable, and noiseless, but less efficient than active heat sinks in high-heat environments.
8. Extruded Heat Sink
Description: These heat sinks are made by extruding a metal (often aluminum) into a specific shape, such as fins or blocks. This process allows for a continuous design and is often used in mass production.
Application: Common in consumer electronics, power supplies, and automotive applications.
Benefits: Cost-effective, customizable, and great for large-scale manufacturing.
9. Bonded Fin Heat Sink
Description: These heat sinks are made by bonding fins to a solid base using soldering or adhesive methods. The fins are usually flat and provide a larger surface area for heat dissipation.
Application: Used in applications requiring high performance where heat needs to be efficiently dissipated from a small area.
Benefits: Offers good thermal performance and flexibility in design.
10. Sintered Metal Heat Sink
Description: These heat sinks are made from metal powders that are sintered together at high temperatures to form a porous structure. The material can provide more surface area for heat dissipation.
Application: Used in high-performance applications where a high thermal capacity and enhanced heat dissipation are required.
Benefits: Great for managing heat in environments with limited airflow.
11. Cold Plate Heat Sink
Description: A cold plate is a flat surface that includes channels for liquid coolant to flow through, which absorbs and carries away heat from the component.
Application: Used in high-power electronics or industrial applications where liquid cooling is an option.
Benefits: Very efficient at removing heat but more complex to set up and requires a liquid cooling system.
12. Heat Sink with Phase Change Material (PCM)
Description: This type of heat sink uses a phase change material (like paraffin wax) that absorbs heat by changing its phase (from solid to liquid), which helps absorb thermal energy more effectively.
Application: Used in situations where you need to store and release thermal energy over a longer period, like in electronics exposed to varying workloads.
Benefits: Helps in situations where there are rapid temperature changes, as PCMs can absorb significant amounts of heat without dramatically increasing temperature.
13. Composite Heat Sink
Description: These heat sinks are made from two or more materials, such as aluminum combined with copper, to combine the thermal properties of each material. Copper has excellent thermal conductivity, while aluminum is light and inexpensive.
Application: Used in applications that require both high thermal conductivity and cost-effectiveness, like in computers or LED lighting.
Benefits: Optimized for higher performance and reduced weight.
The Aluminum Heat Sink Applications

CPU and GPU: In computers, aluminum heat sinks are commonly used to dissipate heat from the central processing unit (CPU) and graphics processing unit (GPU). These components generate a lot of heat, and a heat sink helps keep them within safe temperature limits.
LED Lighting: LED lights generate heat, and aluminum heat sinks help in maintaining optimal operating temperatures to extend their lifespan and efficiency.
Power Supplies: Power electronic components like power transistors and inverters generate heat, so aluminum heat sinks are used for efficient heat dissipation.
Engine Components: Heat sinks are used in automotive engines and electronic systems to prevent overheating and ensure efficient performance.
Electric Vehicles (EVs): With the rise of EVs, heat sinks are crucial in managing the thermal needs of battery packs, power electronics, and electric motors.


Solar Inverters: In solar power systems, inverters that convert DC power to AC power often use aluminum heat sinks to manage thermal stress.
Wind Turbine Electronics: The electronics in wind turbines use heat sinks to ensure components stay within operating temperatures, especially in high-stress environments.
Base Stations: Communication equipment, like base stations for cell towers, often use heat sinks to ensure reliable performance in outdoor environments.
Radio Frequency (RF) Components: RF components used in communications need heat management, and aluminum heat sinks provide an effective solution.


Home Appliances: Some household appliances, such as refrigerators or air conditioners, use aluminum heat sinks to improve efficiency in their cooling mechanisms.
Battery Packs: Devices with battery packs, like laptops, power banks, and electric tools, often employ heat sinks to manage battery temperature.
Medical Imaging Equipment: Heat sinks are crucial in medical devices like MRI machines, ultrasound systems, and CT scanners, where maintaining precise thermal conditions is critical for performance.
Portable Medical Electronics: Devices like portable ECG monitors or blood glucose meters use small aluminum heat sinks to keep internal circuits cool.


HVAC Systems: Aluminum heat sinks are used in heating, ventilation, and air conditioning (HVAC) systems to efficiently manage heat transfer and improve overall system performance.
Electric Motors: Heat sinks help keep industrial motors cool to prevent overheating and ensure long operational lifespans.
Inverters & Rectifiers: Aluminum heat sinks are commonly used in power converters, inverters, and rectifiers to keep these devices within safe temperature ranges.
10. Consumer Electronics



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