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Excellent thermal conductivity: It has a high thermal conductivity coefficient, which can effectively conduct the heat generated by electronic components to the outside, helping to maintain the normal operating temperature of the components and improving the reliability and service life of the electronic equipment.
Good electrical insulation: It has excellent electrical insulation properties, which can prevent electrical short - circuits and leakage between components, ensuring the safe operation of the electrical system.
Strong sealing performance: It can form a tight seal after curing, preventing the entry of moisture, dust and other harmful substances, and protecting the internal components of the equipment from being corroded and damaged.
Good flexibility and shock resistance: The cured silicone potting adhesive has certain flexibility, which can buffer the stress and vibration generated during the operation of the equipment, and avoid damage to the components due to vibration and impact.
Components
Base polymer: Usually, silicone polymers are used as the base material, which provide the basic physical and chemical properties of the potting adhesive, such as flexibility, adhesion and durability.
Thermal conductive filler: In order to improve the thermal conductivity of the potting adhesive, a large number of thermal conductive fillers such as aluminum oxide, silicon carbide and boron nitride are added. These fillers can form a thermal conductive network in the matrix, improving the thermal conductivity of the material.
Curing agent: The curing agent is used to trigger the cross - linking reaction of the base polymer, so that the potting adhesive changes from a liquid state to a solid state. Different curing agents have different curing mechanisms and reaction rates, which can be selected according to specific application requirements.
. Two-component, 1:1 mix for full and deep curing.
A silicone rubber potting compound is used to insulate or conceal electrical circuitry in professional and industrial applications.
- Good fluidity and easy to pot;
- Curable at room temperature or by heating;
- UL94-V0 flame retardant grade;
- 100% solid, no curing byproducts;
- Working temperature -50ºC~200ºC;
- Fully compliant with ROHS directive requirements.
Application
- Power electronics: It is widely used in power modules, transformers, rectifiers and other power electronic devices to dissipate heat and protect components.
- LED lighting: In LED lamps and lanterns, it is used to seal and conduct heat for LED chips, improving the luminous efficiency and service life of LED lamps.
- Electronic devices: It is used in the packaging and heat dissipation of various electronic devices such as computers, mobile phones, and tablets to ensure the stable operation of the devices.
- Automotive electronics: In the automotive electronic system, it is used for the heat dissipation and protection of components such as engine control units, power batteries and automotive lighting systems.
| Test Item | Unit | PS-10 | PS-15 | PS-20 | PS-30 | Test method |
| Composition | / | Organic silicon + ceramic | ||||
| Color/Component A | / | White | White | White | White | Visual |
| Color/Component B | / | Grey | Grey | Grey | Grey | Visual |
| Viscosity/Component A | / | 2000±500 | 4000±500 | 3500±1000 | 12000±2000 | GB/T2794 |
| Viscosity/Component B | / | 2000±500 | 3000±500 | 3500±1000 | 12000±2000 | GB/T1995 |
| Mixing ratio | / | 1:1 | 1:1 | 1:1 | 1:1 | |
| Density | G/cc | 1.7±0.1 | 2.5±0.1 | 2.8±0.1 | 3.1±0.1 | ASTM D792 |
| Operating Time | Min | 30 | 30 | 30 | 30 | GB/T7123.1-2015 |
| Hardness after curing Shore A | / | 55±5 | 45±5 | 35±5 | 35±5 | ASTM D2240 |
| Temperature resistance range | ºC | -50~200 | -50~200 | -50~200 | -50~200 | - |
| Breakdown voltage | Kv/mm | ≥12 | ≥12 | ≥12 | ≥12 | ASTM D149 |
| Volume resistivity | Ω.cm | ≥1*10^13 | ≥1*10^13 | ≥1*10^13 | ≥1*10^13 | ASTM D257 |
| Dielectric constant | @ 10MHz | ≥5 | ≥5 | ≥7 | ≥7 | ASTM D150 |
| Fire rating | / | V-0 | V-0 | V-0 | V-0 | UL94 |
| Thermal conductivity | W/m-k | 1.0±0.1 | 1.5±0.1 | 2±0.2 | 3±0.3 | ASTM D5470 |
ShenZhen DoBon Technology Co., LTD produce thermal conductive and heat dissipation materials.
- 10000 square meters original production base in DongGuan city
- 20 sets production process and 4 fully automatic production line to help quick lead time
- With 100+ manufacturing raw material from oversea country
- We have ROHS, UL, ISO 9001, ISO 14001, IATF 16949 certificate.
Q: Are you trading company or manufacturer ?
A: We are manufacturer, our factory in Dongguan city, China. Welcome to visit us.
Q: How long is your delivery time?
A: Each 100,000 pieces, we need about 3 days to produce.
Q: Do you provide samples ? is it free or extra ?
A: Sample is available, please you need to pay for it.
Q: How to customize a sample?
A: Please send us design of your products, such as size, shape, etc. We can customize your products.
