20W Fiber Laser Marking Machine Price for Metal, Steel, Iron, Aluminum, PVC, Keyboard, Bearings Engraving

Price $7000.00 Compare
Min Order 1 Piece
Shipping From Jiangsu, China
Popularity 397 people viewed
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Jiangsu Himalaya Semiconductor Co., Ltd.

VIP   Audited Supplier 2 years
Profile Certified by SGS/BV
G20
Provided
Provided
Metal
Fiber Laser
Semiconductor Laser
Fiber Laser Marking
Guaranteed Quality
Customized According to Needs
Provided
Himalaya
Customized or Wooden Box Packaging
Standard Specifications
China
Product Description
 
Product Description
Brief Description
1. Various metal materials, part of non-metal materials.
2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for processing fields that need high marking depth, smoothness and accuracy.
Features:
1.Small and compact size, use common air-cooling system.
2.Fiber output, can apply flexibly, and easy to make 3D processing system.
3.Install backward reflecting isolator, which uses the particularity of wavelength and direction of laser, and the special structure inside the backward reflecting isolator, to block the laser reflected by work piece, in order to avoid the laser enter the laser oscillator again to damage the laser oscillator.

Specification:
Specifications
ModelG20
Laser output power20W
Focus lensF160 (standard)   F254(optional)
Lens typeF160 (standard)F254(optional)
Marking area3.9''×3.9''6.3''×6.3''
Marking speed300 characters/sec, height=0.039''300 characters/sec, height=0.039''
Min. character size0.01''0.02''
Min. line width50μm90μm
Wave length1064nm
Beam quality M2<1.6
Power stability(8h)<±1% rms
Pulse repetition frequency1.6kHz-1000kHz
Marking depth≤0.016''
Marking speed≤22.97'/s
Repetition accuracy±0.0001''
Power consumption500W
Indication lightRed light wavelength=650nm
Cooling modeAir cooling
Running temperature15ºC-35ºC
Electrical source requirement110-220V/ 50Hz (60Hz) / 4A
Dimensions (L*W*H)1.8'×2.6'×2.5'
Weight121 KG
 
Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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