Audited Supplier
4inch
Equipment
Na
Integrated Circuits Device
Compound Semiconductor
Custimize
Semi Standard
Na
P-Type Semiconductor
CZ
100
Boron
1-100Ω
Polished
Polished
Fsm
FSM
Semi Standard
TBD
China
3818001920
Product Description
Use reference value
| Item | Specification | ||
| Diameter | 150mm | 200mm | 300mm |
| Type | P/N | P/N | P/N |
| Notch | SEMI/JEIDA | Notch/OF | Notch |
| Thickness(μm) | 675±25/625±25 | 725±25 | 725±25 |
| Surface | Polished | Polished | Polished |
| Inside | Etched | Etched | Etched |
| Package | CoinRoll | CoinRoll | CoinRoll |
150MM/200MM Test wafer
| 150MM | ||
| SPEC | 0.2um≤30ea | |
| Diameter(mm) | 150±0.2mm | |
| Type | P | |
| Olyfra length | 57.5mm±2.5mm | 47.5mm±2.5mm |
| Resistance value ( Ω·cm ) | 1-100 | |
| Thickness(μm) | SEMI | JEIDA |
| 675um±25um | 675um±25um | |
| TTV(μm) | ≤30um | |
| BOW(μm) | ≤40um | |
| WARP(μm) | ≤40um | |
| Surface impurity | ≤5.0E 10 atom/cm² | |
| 200MM | ||
| SPEC | 0.2um≤30ea | - |
| Diameter(mm) | 200±0.2mm | |
| Type | P | |
| Crystal orientation | <110>±1 | |
| Notch direction | ||
| Resistance value ( Ω·cm ) | 1-100 | |
| Thickness(μm) | 725um±25um | |
| TTV(μm) | ≤25um | ≤2um |
| BOW(μm) | ≤40um | |
| WARP(μm) | ||
| LM | NO | |
| Surface impurity | ≤5.0E 10 atom/cm² | |
300MM Test wafer
| 300MM | ||||
| SPEC | 0.045um≤50ea | 0.065um≤50ea | 0.09um<50ea | 0.12um<50ea |
| Manufacturing method | CZ | |||
| Diameter(mm) | 300±0.2mm | |||
| Type/Dopant | P/Boron | |||
| Crystal orientation | <100>±1 | |||
| Notch direction | ||||
| Resistance value (Ω·cm) | 1-100 | |||
| Thickness(μm) | 775±25 | |||
| TTV(μm) | ≤10 | |||
| BOW(μm) | ≤40 | |||
| WARP(μm) | ||||
| LM | T7+ OCR | |||
| Surface impurity | <1 E10 Atoms/cm² | |||
200MM/300MM Oxide wafer
| 200MM | 300MM | |
| Oxide thickness | 500±25nm | |
| Variation in oxide thickness (for one wafer) | <3% | |
| Variation in oxide thickness (for multiple wafers) | <3% | |
| SPEC | 0.2μm≤30ea | |
| Diameter(mm) | 200±0.2mm | 300±0.2mm |
| Type | P | |
| Crystal orientation | <100>±1 | |
| Notch direction | <100>±1 | |
| Resistance value (Ω ·cm) | 1-100 | |
| Thickness(μm) | 725±25 | |
| TTV(μm) | ≤25 | ≤10 |
| BOW(μm) | ≤40 | |
| WARP(μm) | ≤40 | |
| Surface impurity | ≤5.0 E10 Atom/cm² | <1 E10 Atoms/cm² |
* Please contact us for other film types, film thickness, and film composition.
Q: What's the way of shipping ?
A: We accept DHL, Fedex, TNT, UPS, EMS, SF and etc.
Q: How to pay?
A: T/T, PayPal and etc..
Q: What's the deliver time?
A: For inventory: the delivery time is 5 workdays.
For customized products: the delivery time is 7 to 25 workdays. According to the quantity.
Q: Can I customize the products based on my need?
A: Yes, we can customize the material, specifications and optical coating for your optical components based on your needs.
Every customer's specification is unique and FSM can supply wafers that meet your exact specifications.
