2025 HS Laser High Design Picosecond Laser Glass Cutting Machine for Glass Design

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SHENZHEN HS TECHNOLOGY CO., LTD

VIP   Audited Supplier 1 year
Profile Certified by SGS/BV
CE, FDA
Laser Cutting
15 mm
220V
Emergency Stop Button, Safety Sensor
Picosecond Laser Glass Cutting Machine
30W 50W 60W 75W 80W
Picosecond Laser and RF CO2 Laser
1064±5nm
Standard 600X700mm Double Working Table
Single Shot to 8 MHz
Single-Phase 220V±10%, 50/60Hz AC
20-26
HS Laser (Customized )
Plate Sheet Welding
HS LASER
Wooden Box
220V
Shenzhen
8515800090
Product Description

HS LASER Picosecond float glass laser cutting macahine
 

Picosecond Laser Glass Cutting Machine: Applications, Compatible Glass Types, and Cutting Parameters

 

1. Core Application Industries

1.1 Consumer Electronics

  • Target Materials:

    • Smartphone/tablet cover glass (e.g., Corning Gorilla Glass, AGC Dragontrail).

    • Curved glass for wearables (e.g., smartwatches, AR/VR lenses).

  • Key Requirements:

    • Ultra-thin glass cutting (0.3-1.1 mm) with anti-cracking technology.

    • High-precision shaped cuts (e.g., camera holes, fingerprint modules) with ±5 μm accuracy.

  • Case Study:

    • A global smartphone manufacturer uses a 20W picosecond laser to cut 0.7 mm microcrystalline glass, achieving edge chipping <10 μm.

1.2 Automotive & Autonomous Driving

  • Target Materials:

    • Curved glass for automotive triple-screen displays (1.5-3 mm thickness).

    • Quartz optical windows for LiDAR systems.

    • HUD projection glass with anti-glare coatings.

  • Technical Edge:

    • 3D dynamic focusing for cutting curved surfaces (radius ≥8 mm).

    • Heat-affected zone (HAZ) <30 μm, critical for optical clarity.

  • Case Study:

    • Automotive uses a 30W system to cut LiDAR-grade fused silica lenses (1.2 mm thickness).

1.3 Advanced Display Manufacturing

  • Mini/Micro LEDCutting 0.2 mm ultra-thin glass substrates (CTE <3.5×10/K) with 2 μm line accuracy.

  • OLED Flexible Screens:

    • Delicate cutting of glass encapsulation layers (50-100 μm) on PI substrates, using pulse energy <10 μJ to prevent delamination.

1.4 Precision Optics

  • High-End Applications:

    • Fluorophosphate optical glass (refractive index: 1.45-1.9) cutting for lenses and prisms.



    • Infrared chalcogenide glass (e.g., Ge28Sb12Se60) for thermal imaging systems.

  • Case Study:

    • UK-based Renishaw utilizes a 25W picosecond laser to cut 80 mm diameter sulfur-basd glass lenses at 300 mm/s.

2. Glass Types & Cutting Parameters Matrix

Glass TypeKey PropertiesRecommended PowerThickness RangeCutting SpeedCritical Configurations
Soda-Lime Glass (Architectural)Hardness: 5.5 Mohs, CTE: 9×10/K30W+0.5-8 mm200 mm/sNassist to prevent edge carbonization
Borosilicate Glass (Labware)Thermal resistance: 560°C, CTE: 3.3×10/K20-30W0.3-5 mm150 mm/sVacuum chuck to minimize thermal warping
Fused Silica (Optical)Purity: 99.99%, Melting point: 1750°C30W+0.1-10 mm80 mm/s532 nm green laser for optimal absorption
Ultra-Thin Electronic GlassThickness: 0.05-0.3 mm, Flexural strength: >800 MPa10-15W0.05-0.5 mm500 mm/sAir-bearing stage to suppress microcracks
Chemically Strengthened GlassSurface compressive stress: >700 MPa15-25W0.3-2 mm300 mm/sBurst mode to penetrate stress layers
 

3. Power vs. Threshold Guidelines

  • General Rule:

    • Power (W) ≈ 2 × Glass Thickness (mm) + 10 (for standard soda-lime glass).

    • Example: 2 mm glass → ~14W minimum power (add 20-50% buffer for complex shapes).

  • Speed Adjustment:

    • For every 0.1 mm thickness increase, reduce speed by 15-20 mm/s (for borosilicate).

 

4. Industry-Specific Technical Highlights

  • Medical Devices (US Market Focus):

    • Cutting 1 mm bioactive glass (e.g., 45S5 Bioglass®) for endoscopic tools with zero toxic byproducts.

  • Aerospace (UK/Germany Focus):

    • 3 mm aluminosilicate glass cutting for aircraft cabin windows (Ra <0.4 μm post-cutting).

  • Renewable Energy (US/Germany):

    • CdTe thin-film solar glass cutting using 20W + fume extraction to prevent Cd release.

       

Model number: HS-Pi50 /HS-Pi60 /HS-Pi75 / HS-Pi80 /HS-Pi90

Power supply:Single-phase 220V±10%, 50/60Hz AC

Laser power:50W 60W 75W 80W 90W

Whole machine power consumption:

Laser type: Picosecond laser and RF co2 laser

Working environment humidity:20-26°C

Laser wavelength: 1064±5nm

Control system:HS LASER (customized )
Support English operation system

Working area: Standard 600x700mm double working table

CNC machine bed:Plate sheet welding 

Repetition Rate:Single Shot to 8 MHz

Working desk:Marble countertop

 Spatial Mode: M^2 < 1.3

Pulse Width Measured at 1064nm: 10 picoseconds

Pointing Stability Over Constant Temperature +/2 °C: < 50 μrad / °C

Machine weight:>5ton

Picosend cutting speed:500mm/s

Laser cutting head:Bessel  

Detailed Photos

 

HS Laser Float Glass Laser Cutting Macahine with 600X700mm Double Working Table
HS Laser Float Glass Laser Cutting Macahine with 600X700mm Double Working Table

HS Laser Float Glass Laser Cutting Macahine with 600X700mm Double Working TableHS Laser Float Glass Laser Cutting Macahine with 600X700mm Double Working Table
HS Laser Float Glass Laser Cutting Macahine with 600X700mm Double Working TableHS Laser Float Glass Laser Cutting Macahine with 600X700mm Double Working TableHS Laser Float Glass Laser Cutting Macahine with 600X700mm Double Working Table
HS Laser Float Glass Laser Cutting Macahine with 600X700mm Double Working TableHS Laser Float Glass Laser Cutting Macahine with 600X700mm Double Working Table
HS Laser Float Glass Laser Cutting Macahine with 600X700mm Double Working TableHS Laser Float Glass Laser Cutting Macahine with 600X700mm Double Working Table
HS Laser Float Glass Laser Cutting Macahine with 600X700mm Double Working TableHS Laser Float Glass Laser Cutting Macahine with 600X700mm Double Working Table
 
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