Audited Supplier
A01
280°c
OEM, ODM
1-2 Weeks
RoHS, ISO 9001, ISO 14001, GB/T 29490
Air Freight
XianYi
Bulk, Waffle Box, Tape and Reel, Film-Wrap Package
Au80Sn20 Preform
Guangzhou
7115901020
Product Description
AuSn Solder Preforms
Features:
- Eutectic solder with a melting temperature of 280 ºC
- Good wettability and high strength
- Good thermal and electrical performance
- High reliability and stability
Description:
Au80Sn20 is a eutectic alloy with melting temperature of 280ºC . It can be made into a variety of shapes and sizes of preforms to meet different requirements. Au80Sn20 is suitable for applications requiring high temperature strength and thermal
fatigue resistance, and has the advantages of good wettability, high tensile strength and strong corrosion resistance. Au80Sn20 has the closest melting point to high lead solder, and can also avoid the corrosion of gold plating and pad shedding in soldering process on gold or palladium-silver pads. Compared with lead-free eutectic solder with low melting point, the solder has higher stability and reliability.
Au80Sn20 eutectic solder does not required flux in soldering, avoiding contamination and corrosion of semiconductor chips caused by flux use. Au80Sn20 are mainly used in the packaging of optoelectronics, high reliability and high-power electronic devices.
Solder Composition:
Physical Properties:
Method of Use:
Reflow Profile
A gold plating thickness ranging from 0.8~ 1.5μm is recommended for soldering.
Operation Details:
- Picking up:
Use an anti-static tools to pick up the solder to prevent solder contamination and deformation.
- Operating environment:
- Flux Compatibility:
Au80Sn20 solder is compatible with regular no-clean and water-soluble electronic grade fluxes currently.
Dimension Tolerance:
Storage and Product Management:
- Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.
- Product management
Keep container tightly closed when product is not in use.
Safety:
- Please use this product with adequate ventilation and certain personal protection conditions.
- Please do not mix with other toxic chemicals.
List of Common Solders
*Note : In this table, "e" indicates eutectic alloys, "ne" indicates near eutectic alloys and "mp" indicates the melting point of simple substance. Other alloys can be customized for your requirement. For more details please contact us.
Features:
- Eutectic solder with a melting temperature of 280 ºC
- Good wettability and high strength
- Good thermal and electrical performance
- High reliability and stability
Description:
Au80Sn20 is a eutectic alloy with melting temperature of 280ºC . It can be made into a variety of shapes and sizes of preforms to meet different requirements. Au80Sn20 is suitable for applications requiring high temperature strength and thermal
fatigue resistance, and has the advantages of good wettability, high tensile strength and strong corrosion resistance. Au80Sn20 has the closest melting point to high lead solder, and can also avoid the corrosion of gold plating and pad shedding in soldering process on gold or palladium-silver pads. Compared with lead-free eutectic solder with low melting point, the solder has higher stability and reliability.
Au80Sn20 eutectic solder does not required flux in soldering, avoiding contamination and corrosion of semiconductor chips caused by flux use. Au80Sn20 are mainly used in the packaging of optoelectronics, high reliability and high-power electronic devices.
Solder Composition:
| Element | Wt% |
| Gold (Au) | Margin |
| Tin (Sn) | 20.0 ± 0.5 |
Physical Properties:
| Product name | Melting point/ºC solid / liquid phase | Density g/cm3 | Resistivity µΩ·m | Thermal conductivity W/m·K | Thermal expansion coefficient 10-6/ºC | Tensile strength Mpa |
Au80Sn20 | 280 | 14.52 | 0.224 | 57 | 16 | 276 |
Method of Use:
Reflow Profile
Reflow profile of Au80Sn20 Solder Preforms
(For reference only, the reflow profile should be adjusted according to the actual soldering situation)
Plating Thickness of Pads(For reference only, the reflow profile should be adjusted according to the actual soldering situation)
A gold plating thickness ranging from 0.8~ 1.5μm is recommended for soldering.
Operation Details:
- Picking up:
Use an anti-static tools to pick up the solder to prevent solder contamination and deformation.
- Operating environment:
| Atmosphere | Parameter requirements |
| N2 | Oxygen concentration(200~ 1000ppm) |
| Vacuum | Vacuum degree ≤ 2.0×10-3Pa |
- Flux Compatibility:
Au80Sn20 solder is compatible with regular no-clean and water-soluble electronic grade fluxes currently.
Dimension Tolerance:
| Thickness(t) | Typical tolerances for length, width or diameter(L/W/D) | |
| t <0.40mm | ±0.02mm | |
| 0.40mm≤ t <1.00mm | ±0.03mm | |
| t ≥1.00mm | ±0.05mm | |
| Thickness(t) | Thickness (t) | |
| Conventional solder alloys | Indium alloy | |
| t<0.05mm | ±0.005mm | ±0.01mm |
| 0.05mm≤ t <0. 10mm | ±0.008mm | ±0.01mm |
| 0. 10mm≤ t <0.20mm | ±0.01mm | |
| 0.20mm≤ t <0.40mm | ±0.02mm | |
| 0.40mm≤ t <1.00mm | ±0.03mm | |
| t ≥1.00mm | ±5% | |
Storage and Product Management:
- Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.
- Product management
Keep container tightly closed when product is not in use.
Safety:
- Please use this product with adequate ventilation and certain personal protection conditions.
- Please do not mix with other toxic chemicals.
List of Common Solders
| Category | Products | Solidus(ºC) | Liquidus(ºC) | Density (g/cm3) | Resistivity (μΩ·m) | Thermal Conductivity (W/m ·K) | CTE (10-6/ºC) | Tensile Strength (MPa) |
Solder Metal | In51Bi32.5Sn16.5 | / | 60(e) | 7.88 | 0.522 | / | 22 | 33.44 |
| In66.3Bi33.7 | / | 72(e) | 7.99 | / | / | / | / | |
| Bi50Pb28Sn22 | / | 100(e) | 9.44 | / | / | / | / | |
| In52Sn48 | / | 118(e) | 7.3 | 0. 147 | 34 | 20 | 12 | |
| In50Sn50 | 118 | 125 | 7.3 | 0. 147 | 34 | 20 | 11.86 | |
| Bi58Sn42 | / | 138(e) | 8.56 | 0.383 | 19 | 15 | 55. 16 | |
| Bi57Sn42Ag1 | 138 | 140 | 8.57 | / | / | / | / | |
| In97Ag3 | / | 143(e) | 7.38 | 0.075 | 73 | 22 | 5.5 | |
| Sn43Pb43Bi14 | 144 | 163 | 9.02 | / | / | 24 | 44. 1 | |
| In80Pb15Ag5 | 149 | 154 | 7.85 | 0. 133 | 43 | 28 | 17.58 | |
| Sn53Pb37Bi10 | 150 | 168 | 8.65 | / | / | / | / | |
| Sn70Pb18In12 | 154 | 167 | 7.79 | 0. 141 | 45 | 24 | 36.68 | |
| In100 | / | 157(mp) | 7.31 | 0.072 | 86 | 29 | 1.88 | |
| In70Pb30 | 165 | 175 | 8. 19 | 0. 195 | 38 | 28 | 23.79 | |
| In60Pb40 | 174 | 185 | 8.52 | 0.246 | 29 | 27 | 28.61 | |
| Sn77.2In20Ag2.8 | 175 | 187 | 7.25 | 0. 176 | 54 | 28 | 46.88 | |
| Sn62Pb36Ag2 | / | 179(e) | 8.42 | 0. 145 | 42 | 27 | 44 | |
| Sn63Pb37 | / | 183(e) | 8.4 | 0. 146 | 51 | 25 | 52 | |
| In50Pb50 | 184 | 210 | 8.86 | 0.287 | 22 | 27 | 32.2 | |
| Pb60In40 | 197 | 231 | 9.3 | 0.331 | 19 | 26 | 34.48 | |
| Sn86.9In10Ag3. 1 | 201 | 205 | 7.37 | / | / | / | / | |
| Au10Sn90 | / | 217(e) | 7.78 | / | / | / | 50.2 | |
| SAC387(Sn95.5Ag3.8Cu0.7) | / | 217(ne) | 7.4 | 0. 132 | 57 | 22 | 48 | |
| SAC305(Sn96.5Ag3.0Cu0.5) | 217 | 218 | 7.37 | 0. 132 | 58 | 21 | 50 | |
| Sn96.5Ag3.5 | / | 221(e) | 7.37 | 0. 108 | 33 | 30 | 39 | |
| Sn99.3Cu0.7 | / | 227(e) | 7.31 | / | / | / | / | |
| Sn100 | / | 232(mp) | 7.29 | 0. 111 | 73 | 24 | 13. 1 | |
| Sn65Ag25Sb10 | / | 233(e) | 7.8 | / | / | 36 | 117.2 | |
| Sn95Sb5 | 235 | 240 | 7.25 | 0. 145 | 28 | 31 | 40.7 | |
| Sn90Sb10 | 240 | 250 | 7.22 | / | 42 | 27 | 44 | |
| Pb75In25 | 240 | 260 | 9.97 | 0.375 | 18 | 26 | 37.58 | |
| Pb88Sn10Ag2 | 268 | 290 | 10.75 | 0.203 | 27 | 29 | 22.48 | |
| Pb90Sn10 | 275 | 302 | 10.75 | / | / | 24.6 | 32 | |
| Au80Sn20 | / | 280(e) | 14.52 | 0.224 | 57 | 16 | 276 | |
| Pb92.5Sn5Ag2.5 | 287 | 296 | 11.02 | 0.2 | 29 | 24 | 29.03 | |
| Pb90Sn5Ag3In2 | 294 | 297 | 10.89 | / | / | / | / | |
| Pb92.5In5Ag2.5 | 300 | 310 | 11.02 | 0.313 | 25 | 25 | 31.44 | |
| Au88Ge12 | / | 361(e) | 14.67 | 0. 151 | 44 | 13.4 | 185 | |
| Au96.8Si3.2 | / | 363(e) | 15.4 | / | 27 | 12 | 255 | |
| Au98Si2 | 363 | 390 | 16.92 | / | / | / | / | |
Brazing Metal | Ag60Cu30Sn10 | 600 | 720 | 9.58 | / | / | / | / |
| Ag72Cu28 | / | 780(e) | 10 | / | 352 | 17.8 | 250-360 | |
| Ag50Cu50 | 780 | 870 | 9.67 | / | / | / | / | |
| Au60Ag20Cu20 | 835 | 845 | 13.79 | / | / | / | / | |
| Ag92.5Cu7.5 | / | / | 10.37 | / | / | / | / | |
| Au80Cu20 | / | 910(e) | 15.67 | / | / | / | / | |
| Au50Cu50 | 955 | 970 | 12.22 | / | / | / | / | |
| Ag100 | / | 961(mp) | 10.49 | 0.0163 | 429 | / | 180 | |
| Au100 | / | 1064(mp) | 19.3 | 0.0221 | 318 | 14 | 138 | |
| Cu100 | / | 1083(mp) | 8.96 | 0.0172 | 401 | / | 246 |
