RoHS Compliant & Halogen Free
Radial-leaded Devices
Cured,flame retardant epoxy polymer insulating material meets UL94V-0 requirements
Operation Current: 0.5A~9A ,Maximum Voltage:30Vdc,Operating Temperature:-40ºC TO 85ºC
Product Dimensions
Unit :mm
JK30 Series
Model | Dimensions(mm) | Lead material | Shape | ||||
A(max) | B(max) | C(max) | D | E(min) | Tinned metal(mm) | Fig | |
JK30-050 | 7.4 | 12.7 | 3.0 | 5.1±0.75 | 4.6 | 24 AWG/Φ0.5 | 1 |
JK30-075 | 7.4 | 13.0 | 3.0 | 5.1±0.75 | 4.6 | 24 AWG/Φ0.5 | 1 |
JK30-090 | 7.4 | 18.5 | 3.0 | 5.1±0.75 | 4.6 | 24 AWG/Φ0.5 | 2 |
JK30-110 | 7.4 | 18.5 | 3.0 | 5.1±0.75 | 4.6 | 24 AWG/Φ0.5 | 2 |
JK30-120 | 7.4 | 18.5 | 3.0 | 5.1±0.75 | 4.6 | 24 AWG/Φ0.5 | 2 |
JK30-135 | 9.2 | 17.6 | 3.0 | 5.1±0.75 | 4.6 | 24 AWG/Φ0.5 | 2 |
JK30-160 | 9.2 | 20.2 | 3.0 | 5.1±0.75 | 4.6 | 24 AWG/Φ0.5 | 2 |
JK30-185 | 9.2 | 20.2 | 3.0 | 5.1±0.75 | 4.6 | 24 AWG/Φ0.5 | 2 |
JK30-200 | 15.2 | 20.2 | 3.0 | 5.1±0.75 | 4.6 | 24 AWG/Φ0.5 | 2 |
JK30-250 | 13.2 | 22.4 | 3.0 | 5.1±0.75 | 4.6 | 24 AWG/Φ0.5 | 2 |
JK30-300 | 13.2 | 20.4 | 3.0 | 5.1±0.75 | 4.6 | 20 AWG/Φ0.8 | 3 |
JK30-400 | 14.0 | 23.7 | 3.0 | 5.1±0.75 | 4.6 | 20 AWG/Φ0.8 | 3 |
JK30-500 | 14.0 | 23.7 | 3.0 | 10.2±0.75 | 4.6 | 20 AWG/Φ0.8 | 3 |
JK30-600 | 17.2 | 27.0 | 3.0 | 10.2±0.75 | 4.6 | 20 AWG/Φ0.8 | 3 |
JK30-700 | 17.2 | 27.0 | 3.0 | 10.2±0.75 | 4.6 | 20 AWG/Φ0.8 | 3 |
JK30-800 | 23.5 | 29.2 | 3.0 | 10.2±0.75 | 4.6 | 20 AWG/Φ0.8 | 3 |
JK30-900 | 23.5 | 29.2 | 3.0 | 10.2±0.75 | 4.6 | 20 AWG/Φ0.8 | 3 |
Thermal Derating Chart-IH(A)(Just FYI)
Model | Maximum ambient operating temperature(ºC) | |||||||||
-40ºC | -20ºC | 0ºC | 25ºC | 30ºC | 40ºC | 50ºC | 60ºC | 70ºC | 85 | |
JK30 series | 137% | 130% | 115% | 100% | 91% | 83% | 77% | 68% | 61% | 52% |
Electrical Characteristics
Model | IH(A) | IT (A) | Vmax | Imax | Pd | Maximum Time-to-Trip | Resistance(mΩ) | |||
V(DC) | A | W | Current (A) | Time(S) | Rmin | Rmax | ||||
JK30-050 | 0.5 | 1.0 | 30 | 40 | 0.5 | 2.5 | 5.0 | 250 | 600 | |
JK30-075 | 0.75 | 1.5 | 30 | 40 | 0.6 | 3.75 | 5.0 | 200 | 370 | |
JK30-090 | 0.90 | 1.8 | 30 | 40 | 0.7 | 4.5 | 8.0 | 100 | 220 | |
JK30-110 | 1.10 | 2.2 | 30 | 40 | 0.7 | 5.5 | 8.0 | 70 | 200 | |
JK30-120 | 1.20 | 2.4 | 30 | 40 | 0.8 | 6.0 | 8.0 | 80 | 160 | |
JK30-135 | 1.35 | 2.7 | 30 | 40 | 0.8 | 6.75 | 8.0 | 70 | 160 | |
JK30-160 | 1.60 | 3.2 | 30 | 40 | 0.9 | 8.0 | 8.0 | 60 | 140 | |
JK30-185 | 1.85 | 3.7 | 30 | 40 | 1.0 | 9.25 | 8.0 | 50 | 120 | |
JK30-200 | 2.00 | 4.0 | 30 | 40 | 1.2 | 10.0 | 11 | 40 | 100 | |
JK30-250 | 2.50 | 5.0 | 30 | 40 | 1.2 | 12.5 | 11 | 30 | 80 | |
JK30-300 | 3.00 | 6.0 | 30 | 40 | 2.0 | 15.0 | 11 | 30 | 70 | |
JK30-400 | 4.00 | 8.0 | 30 | 40 | 2.5 | 20.0 | 12.7 | 10 | 60 | |
JK30-500 | 5.00 | 10 | 30 | 40 | 3.0 | 25.0 | 14.5 | 10 | 50 | |
JK30-600 | 6.00 | 12 | 30 | 40 | 3.5 | 30.0 | 16 | 5 | 40 | |
JK30-700 | 7.00 | 14 | 30 | 40 | 3.8 | 35.0 | 17.5 | 5 | 30 | |
JK30-800 | 8.00 | 16 | 30 | 40 | 4.0 | 40.0 | 18.8 | 5 | 25 | |
JK30-900 | 9.00 | 18 | 30 | 40 | 4.2 | 40.0 | 20 | 5 | 20 |
IH=Hold current:Maximum current at which the device will not interruptin 25ºC still air.
IT=Trip current:Minimum current at which the device from low resistance to high resistance in 25ºC still air.
Vmax=Maximum continuousvoltage device can withstand without damage at rated current.
Imax=Maximum fault current device can withstand without damage at rated voltage.
Maximum Time-to-trip:Maximum time to trip at assigned current.
Pd=Typical power dissipation:Typical amount of power dissipated from the device when in 25ºC still air environment.
Rmin=Minimum resistance of device at 25ºC prior to tripping.
Rmax=Maximum resistance of device at 25ºC prior to tripping.
Soldering method
Wave Soldering
Soldering Temperature:245ºC~260ºC
Soldering Time:≤5sec

Manual soldering
Soldering Temperature:250ºC~280ºC
Soldering Time: ≤3sec
Soldering Position: Resettable fuse lead and the distance fromthe bottom ≥ 6mm
Storage
The maximum ambient temperature shall not exceed 40ºC.Storage temperature higher than 40ºC could result in the deformation of packaging materials.The maximum relative humidity recommended for storage is 60%.High humidity with high temperature can accelerate the oxidation of the solder plating on the leads and reduce the solderability of the components.Sealed plastic bags with desiccant shall be used to reduce the oxidation of the leads and shall only be opened prior to use.The products shall not be stored in areas where harmful gases containing acid or alkali or other harmful substancesare present. The sealed product can be stored for 1 year, and it is recommended to return to our company for inspection after the expiration date.
Warning:
• Please read this specification before using the product.
• Use PPTC beyond the maximum ratings or improper use may result in device damage, electrical arcing and flame.
• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components.
• Use PPTC with a large inductance in circuit will generate a circuit voltage above the rated voltage of the PPTC.
• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
• Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices.PPTC can be cleaned by standard methods.



