Audited Supplier
| Name | Lead-free solder paste |
| Alloy | Sn/Ag3.5/Cu0.7/Bi3/X |
| Package | 500g/bottle |
| Melting point | 217~227ºC |
| Particles | 25-38um(custom made) |
| Viscosity | 180±30Pa.S |
| Copper corrosion | Not happen |
The Sn/Ag3.5/Cu0.7/Bi3/X Solder Paste is designed for advanced soldering applications, offering excellent wetting properties and low-temperature reflow capabilities. The inclusion of bismuth lowers the melting point and reduces thermal stress on sensitive components during assembly, while silver and copper enhance joint strength and conductivity.
The paste's unique composition supports fine-pitch printing and complex microelectronics assembly, enabling higher precision and fewer rework incidents.
In an era where efficiency and durability are paramount, our Sn/Ag3.5/Cu0.7/Bi3/X Solder Paste sets a new standard. It is not just about adhering components; it's about enhancing the life and functionality of every device. Ideal for industries pushing the boundaries of technology, this paste supports your goals of innovation and sustainability, ensuring that every product is built to last and designed to perform.
Applications of Lead-Free Solder Bar SAC305
Complex Electronics: Ideal for use in sophisticated electronic devices such as smartphones, tablets, and other high-tech gadgets where durability and performance are key.
Automotive Electronics: SAC305's strong thermal and mechanical properties make it suitable for automotive electronic assemblies that must endure harsh operating conditions.
Medical Devices: Given its high reliability and compliance with environmental health standards, SAC305 is frequently used in the manufacturing of medical electronics, where safety and precision are paramount.
Aerospace and Defense: In applications that demand extreme reliability and resistance to thermal fatigue, SAC305 is a preferred choice, supporting the critical operations of aerospace and defense electronics.
Our product comes in environmentally friendly green cans, with a default weight of 500 grams, customizable to meet specific customer needs. Each can is labeled with essential details including the product model, alloy composition, batch number, and weight. Additionally, the solder paste label provides concise instructions for use, along with safety and health guidelines. "ZS.HX Zhongshi" is the proud registered trademark of our company.
For enhanced storage stability, store the solder paste in a cool environment at 5 ºC. When kept at room temperature of 25 ºC or in a controlled setting of 35 ºC, monitor the viscosity periodically over 180 days at 25 ºC and 90 days at 35 ºC, ensuring the increase in viscosity remains below 10%.
Regarding continuous printing stability, maintain the same solder paste for 8 hours of printing and assess the viscosity using a steel net. Continue this process after storage and repeat for 3 consecutive days. Consistent viscosity is confirmed after three days of ongoing printing.
Lead-free solder wire
Tin-lead solder wire
Solder bar
Our products are compliant with ROHS and REACH standards, having undergone rigorous testing and certification. With every order, we provide a corresponding SGS certificate along with a material safety data sheet. For further details on this product's MSDS, our sales team is available to assist you.
