Audited Supplier
AA INC-AMB20310
Aerospace, Electronics, Medical, Vacuum Brazing
2300MPa
8-30μm
Mo/Mn
Nickel/Copper/Gold
25W/(M.K)
2-9μm
1600ºC
3.7g/cm3
Alumina, Al2O3
High Insulation, High Strength
Insulating Ceramics
INNOVACERA
Standard Cartons with Foam
Customized
Fujian, China
Product Description
Aluminum Nitride AMB Ceramic Substrate is a method to realize the bonding of ceramic and metal by reacting a small amount of active elements Ti and Zr in filler metal with ceramics to form a reaction layer which can be wetted by liquid filler metal.
Advantage:
* The combination is achieved by chemical reaction between ceramic and active metal solder paste at high temperature, so its bonding strength is higher and reliability is better;
* Could have different thickness of copper on one plate;
* Environmental frindly;
* Strong cold and heat resistance;
* Easy full automation, production efficiency high, low production cost;
* Copper thickness 0.1-0.5mm,very suitable for high power device packaging.
* Could have different thickness of copper on one plate;
* Environmental frindly;
* Strong cold and heat resistance;
* Easy full automation, production efficiency high, low production cost;
* Copper thickness 0.1-0.5mm,very suitable for high power device packaging.
Specification
>Metallization thickness: 25 ±10um >Nickel thickness:2~10um; >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)
Material | Item | Value |
Composition | 96%SiN | |
Thickness (mm) | 0.2,0.32,0.35,0.635,0.4-1.5 | |
Density(g/cm3) | 3.2±0.25 | |
Thermal Conductivity (20°C, W/m·k) | 85+ | |
Flexural Strength (MPA) | 700-800 | |
Dielectric Constant (IMHz) | 8 | |
Dielectric loss (IMHz) | 0.001 | |
Dielectric Strength (KV/mm) | 20 | |
Volume Resistivity (Ω/CM) | 1*1014 | |
Composition | 96%ALN | |
Thickness (mm) | 0.25,0.32,0.635 | |
Density(g/cm3) | 3.3 | |
Thermal Conductivity (20°C, W/m·k) | 170+ | |
Flexural Strength (MPA) | 350 | |
Dielectric Constant (IMHz) | 9 | |
Dielectric loss (IMHz) | 0.0005 | |
Dielectric Strength (KV/mm) | 20 | |
Volume Resistivity (Ω/CM) | 1014 | |
Material | Oxygen-free copper | |
Purity (%) | 99.99 | |
Hardness( HV) | 60-110 | |
Conductivity (MS/m) | 58.6 | |
Thickness (mm) | 1.2,1.0,0.8,0.5,0.4,0.3,0.25,0.2 | |
AMB Substrate | Largest size (mm) | 190*140 |
Line Spacing (mm) | ≥0.5 | |
Line Width (mm) | customized | |
Peel strength of copper layer (minimum) (N/mm) | 10 | |
Solderability(%) | 95% | |
Delivery method | Small pieces or panel | |
Surface states (um) | CU/AU/AG |
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