Preforms Sn98.5Ag1.0Cu0.5
Flux-cored Wire
Tin
Containing Flux
Acidic
<10mm
217
0.05~7.0mm(Custom Made)
1 Year
PCB, PPR
Yes
7.32g/cm3
60
Zhongshi/Customized
Zhongshi
customized
China
3810100000
Product Description
Name | Lead Free solder Preforms |
Ingredient | Sn98.5Ag1.0Cu0.5 |
Diameter | Custom made |
Package | Custom made |
Melting point | 217ºC |
Sn98.5Ag1.0Cu0.5 Solder Preforms are pre-cut pieces of solder designed to provide exact solder quantities for specific joint requirements, ensuring consistent quality and reducing waste. This alloy is known for its good wetting properties and a strong bond, making it suitable for high-performance applications in electronics where precise solder deposition is crucial
The high silver content enhances the mechanical strength and thermal fatigue resistance of the solder joints, which is crucial for applications subject to thermal cycling or mechanical stress.
high-quality, durable joints with minimal effort and time, optimizing both installation and long-term reliability. These preforms are designed to meet stringent industry standards, providing consistent results and reducing the risk of joint failure.

We offer customization options to incorporate your own branding on the product.
Solder wire
Solder PasteSolder bar

Our products have passed ROHS and REACH testing and certification. Each order can be accompanied by a batch of SGS certificate, material safety data sheet. The MSDS of this product can be obtained from our sales staff.