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Thermal conductivity tape, also known as double-sided thermal conductivity tape, has the characteristics of high thermal conductivity, high viscosity and low thermal impedance, which can effectively replace the characteristics of thermal paste and mechanical fixing.Used to fill the uneven gap between heat source and metal products, take away the heat generated by electronic products.To achieve the effect of cooling and heat dissipation.
Among them, thermal conductivity tape can be divided into substrate and non-substrate.The common ingredient is a pressure sensitive adhesive with acrylic as the base and silicone as the base.Acrylic is the base material, suitable for porcelain and metal interface, and silica gel is the heat conduction tape of the base material, often used for plastic contact surface.In addition, common reinforcing materials for thermal tape are fiberglass or polyimide for increased stiffness and pressure resistance.
Thermal tape is usually used to adhere to small or slender electronic components.Because of its thermal conductivity and bonding function, it is suitable for the small chip on the computer motherboard, the small radiator of the video graphics card or the panel of the backlight module.
| Product name: | thermal conductive tape |
| Material | Glass cloth with acrylic adhesive |
| Color: | White tape with blue liner |
| Thickness: | 0.15mm |
| Width: | 2mm-5mm |
| Total Length: | Approx. 25m / 82ft |
| 180°Stripping resistance: | >13 N/25mm |
| Long-term temperature resistance | 100 ºC |
| Short-term temperature resistance | 150 ºC |
| Continuous use temp | -20~+100 ºC |
| Retentivity | >48 1kg/inch |
| Bonding strength | 1.1 kg/inch |
| Withstand voltage | 2 kv/mm |
| Thick viscous strength | 0.6 kg/inch |
| Thermal conductivity | ≥0.8 w/m.k |
| Feature: |
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| Application: | 1.For CPU, LED,PPR heat sink, microprocessor 2.For any power consumption semiconductor 2.Replacing screws, fasteners and other fixed means 4.Fixing heat sink on the power supply circuit board 5.Fixing heat sink on vehicle control circuit board 6.Fixing heat sink on packaged chips |
| MOQ: | 1rolls |
| Trade Term: | FOB |
| Sample Lead Time: | 3-5 Days |
| Production Lead Time: | Usually 5-7days |
| Payment Term: | T/T or L/C or Paypal |
| Freight: | Air,Sea,Express (door to door shipping EMS FEDEX UPS DHL ) |
| Packing: | 1 x Adhesive Tape |
FAQ >>>1.Q:Are you a factory?
A:Yes. Our factory was established in 2009.
2.Q: Will you accept customized requirement?
A: Of course, customized service is surely acceptable. Welcome to send us your drawing and more detailed specification parameters.
We can supply you the products as per your specific requirements.
3.Q:Can we order products?
A:Yes. We can design and produce according to customers'requirements. ODM/OEM orders are welcome.
4. Q:Could I get some sample?
A: Yes, its our honnr to offer sample for your reference.just let us know once you need.
5.Q: What's the delivery time for sample?
A: Generally it shall take 5~7days. For certain products, we need to prepare the materials for it. That depends.
