New Product-7
Double-Sided Rigid PCB
FR-4
Consumer Electronics
V0
OSP,Immersion Gold,Hal Lead Free,Hal
Green,Red,Yellow,White,Black,Blue,etc
Air,Sea,Express(DHL TNT FedEx EMS UPS)
3-5days
ZAPON
Vacuum Packing
UL, TS16949, IPC 600 CLASS 2
China
85340090
Product Description
Material: FR-4
Layer Coverage: 4Layers
Thickness: 1.6mm
Surface Technique: HAL Leadfree + Gold Finger
Line Width/Space: 5mil/5mil
Solder Mask Color: Green
Special: BGA, Gold Finger
he products:
Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free
Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)
Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS
THE CAPACITY OF PRODUCTION: 50, 000SQM. /month
Layer Coverage: 4Layers
Thickness: 1.6mm
Surface Technique: HAL Leadfree + Gold Finger
Line Width/Space: 5mil/5mil
Solder Mask Color: Green
Special: BGA, Gold Finger
he products:
Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free
Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)
Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS
THE CAPACITY OF PRODUCTION: 50, 000SQM. /month
Capabilities | ||
Number of Layers | From 4-layer to 22- Layer | |
Material | FR-4,HighTg, Rogers Halogen Free | |
PCB Thickness | Min.thickness | 0.4mm(16mil) |
Max.thickness | 3.2mm(128mil) | |
Surface finished | Gold Plating | |
Immersion Gold(Silver) | ||
HAL Lead Free | ||
Hot Air Solder Leveling(HASL) | ||
Entek Coating (OSP) | ||
Solder Mask | Green,White,Black,Yellow,Red,Blue | |
Other printing | Gold Finger | |
Carbon Print, Peelable Mask | ||
Solder Mask Plugged Hole | ||
Copper thickness | 1/ 2 oz (18 μm) - 4 oz (140 μm) | |
Min. Finished Hole Size | 0.2mm(8mil) | |
Hole Size Tolerance (PTH) | +/ -0.076mm (3 mil) | |
Hole Size Tolerance (NPTH) | +/-0.05mm (2 mil) | |
Min. Line Width and Spacing | 0.1mm (4 mil) | |
Min. Solder Mask Clearance | 0.05mm (2 mil) | |
Min. Annular Ring | 0.076mm (3mil) | |
Profile and V-Cut | CNC-Routing, Stamping and Beveling,V-CUT,CNC | |
Special Process | Micro-section, Chamfer for Gold Finger | |
File format | Gerber file , CAM350 ,Protel,PowerPCB | |
E-TEST | Flying Prob , E-test ,Fixture | |
Other Test | Impedance , Slice up | |
Warp & Twist | ≤0.7% |