High Precision FPC Package Dispenser Machine Automatic Silicone Wafer Equipment Factory

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Jiangsu Himalaya Semiconductor Co., Ltd.

VIP   Audited Supplier 2 years
Profile Certified by SGS/BV
Free Training
High Precision
New
RoHS, ISO, CE
12 Months
Automatic
Desktop
Electric
FPC Package Dispenser Machine
Guaranteed Quality
Customized According to Needs
1 Year Warranty
Himalaya
Customized or Wooden Box Packaging
Standard Specifications
China
Product Description

High Precision FPC Package Dispenser machine Automatic Silicone wafer Equipment factory
 
Product Description

Standard Features 

Computer Control, Windows OS
CCD visual positioning system
Servo Motor
UPS and voltage stabilizer
ESD grounding point-
CE certifed

 

Optional Features 

Automatic constant temperature system to ensure the fuidity consistent
Laser Height Detection to calibrate Z axis automatically for component
deformation

Product advantage:

TSV Series desktop dispensing system is applicable for LENS dispensing, FPC package, SMT red glue dispensing, solder past dispensing, LED package, fingerprint identifcation module, etc. 

 

Specifications

 

TSV-300

 

HSV-300

Dimension (mm)

 

L810×W660×H760

 

L900×W650×H1460

Weight (kg)

 

105

 

190

Control

 

Industrial personal computer + motion control card

Software

 

Anda control software + windows system

Programming

 

Visual programming

Number of spindles

 

X,Y,Z

Spindle drive

 

Servo motor + module

Working area (mm)

 

X:260 ; Y:260 ; Z:100

Quantity of rubber valve

 

1 (standard configuration)

Max. Moving speed (mm/s)

 

800

Repeatability (mm)

 

± 0.025

Coating capacity (cc)

 

30

Valve nozzle

cleaning device

 

Vacuum cleaning

Equipment alarm

 

Menu + sound and light alarm

Coating inspection

 

Automatic detection

Power supply

 

220V 50/60Hz

Required air pressure (Mpa)

 

≥ 0.65

Safety standards

 

CE

Rated power (kw)

 

1

Standard configuration

 

CCD visual positioning;  Electrostatic interface;  232 scanner socket

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:Why choose us ?
A3:OEM/ODM/Designing. 

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