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High Quality Mo1 Molybdenum Boat Crucible

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Luoyang Tongchang Tungsten & Molybdenum Material Co., Ltd.

Audited Supplier 15 years

Profile Certified by SGS/BV

Henan, China
Christine Lu (Ms.)
Sales Manager

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Product Detail

Model NO.:

Mo-1

Application:

Aviation, Electronics, Industrial, Medical, Chemical

Standard:

GB, ASTM

Purity:

99.95%

Alloy:

Non-alloy

Type:

Special Shape

Powder:

Not Powder

Surface:

Bright

Condition:

Turned

Density:

10.2

Trademark:

tongchang

Transport Package:

Wooden Boxes

Specification:

as per drawing

Origin:

China

HS Code:

8102990000

Product Description

Molybdenum tube and Crucible

Molybdenum tube purity: >99.95%
Molybdenum boat, molybdenum crucibles, sintered molybcenum tube, turning molybdenum tube, molybdenum funnels, molybdenum barrel, molybdenum tubes and various kinds of special liquid- flow hole panel, etc.

Applications:
Molybdenum is widely used to produce crucibles and other parts for Sapphire crystal growth and rare-earth melting with its high temperature resistance, low pollution and other good characteristics.

Size:
Provide all kinds of Molybdenum crucibles according to customer's drawings and machine to reach high precision.

MoCu alloy is a kind of pseudo-alloy that is composed of molybdenum and copper. It consists of both the characteristics of molybdenum and copper, having high thermal conductivity, low adjusted thermal expansion coefficient, Beijing non-magnetic, low content of gas, good vacuum resistance, good machinability and special high-temperature performance, etc.

Compared with WCu alloy, MoCu alloy has lower density and is easier to stamp, It makes MoCu suitable for valume produce.

Product Brief Introduction:
Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.

Surface: Plating Ni, NiAu, NiAg, or Non-plating

Product Properties:
Physical Properties of Major Products

Material	Wt% Molybdenum Content	Wt% Copper Content	g/cm³ Density at 20ºC	Thermal conductivity at 25ºC	Coefficient of thermal expansion at 20ºC
Mo85Cu15	85± 1	Balance	10	160 - 180	6.8
Mo80Cu20	80 ± 1	Balance	9.9	170 - 190	7.7
Mo70Cu30	70 ± 1	Balance	9.8	180 - 200	9.1
Mo60Cu40	60 ± 1	Balance	9.66	210 - 250	10.3
Mo50Cu50	50 ±0.2	Balance	9.54	230 - 270	11.5

Applications:
These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

Product Brief Introduction:
Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.

The features of copper molybdenum copper
Large sized sheets available (length up to XXmm, width up to XXXmm)
Can be stamped into components
Strong interface bonding resist to 850ºC heat shock repeatedly
Tailorable CTE matching that of semiconductor and ceramics
High thermal conductivity

Product Properties:

Materials	Density at 20ºC	Coefficient of thermal expansion at 20ºC	Thermal conductivity at 25 ºC
Materials	Density at 20ºC	Coefficient of thermal expansion at 20ºC	In - plane	thru - thickness
13:74:13	9.88	5.6	200	170
1:4:1	9.75	6.0	220	180
1:3:1	9.66	6.8	244	190
1:2:1	9.54	7.8	260	210
1:1:1	9.32	8.8	305	250

Applications:
Applications are similar with W-Cu composites.
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mounts.

Product Brief Introduction:
Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1:4:1. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components,.

Features of Cu/Mo70Cu/Cu
Large sized sheets available (length up to XXmm, width up to XXmm)
More easily to be stamped into components than CMC
Very strong interface bonding which can repeatedly resist 850ºC heat shock
Higher thermal conductivity and lower cost

Product Properties:

Materials	Density at 20ºC	Coefficient of thermal expansion at 20ºC		Thermal conductivity at 25 ºC
Materials	Density at 20ºC	In - plane	thru - thickness	In - plane	thru - thickness
1:4:1	9.4	7.2	9.0	340	300

Diameter(mm)	Wall Thickness(mm)	Length(mm)
30~50	0.3~10	<2000
50~100	0.5~15
100~150	1~15
150~300	1~20
300~400	1.5~30
400~500	2~30

Grade	The impurity content is not more than %
Grade	Fe	Ni	Al	Ca	Si	Mg	C	N	O
Mo-1	0.010	0.005	0.002	0.002	0.01	0.002	0.01	0.003	0.008

Mocu alloy products

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Company information
We have been exporting for more than 10 years,our products and teams are worthy of your trust.We'd like to establish friendly cooperation relations with you from all over the world.Dear friend,we are all from the earth,expect to meet you,my friend.Let's go forward together.

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