Audited Supplier
FSM 6″ (150mm) Borofloat 33 Glass Wafer
Overview:
FSM introduces the 4″ (100mm) Borofloat Glass Wafer, a high-quality substrate material ideal for a wide range of applications in the semiconductor and electronics industries. Borofloat glass is a borosilicate glass known for its excellent thermal properties, chemical resistance, and mechanical stability. These wafers are perfect for applications requiring a robust, yet transparent material.
Key Specifications:
| Specification | Value |
|---|---|
| Material | Borosilicate Glass (Borofloat 33) |
| Diameter | 150mm ± 0.2mm |
| Surface Quality | Scratch-Dig 40/20 |
| BOW | ≤25µm |
| WARP | ≤25µm |
| TTV | ≤5µm |
| Thermal Properties | Low coefficient of thermal expansion |
| Chemical Resistance | High resistance to water, acids, and organic substances |
| Transparency | High transparency in the visible and near-infrared spectrum |
| Packaging | Cleanroom packed, individual cassettes |
Key Features:
- High Thermal Resistance - Borofloat glass wafers can withstand high temperatures without deforming, making them suitable for high-temperature processing.
- Chemical Durability - The wafers exhibit excellent resistance to a wide range of chemicals, ensuring longevity in harsh environments.
- Optical Clarity - With high transparency in the visible and near-infrared spectrum, these wafers are ideal for optical applications.
- Mechanical Strength - Borofloat glass provides a strong and stable substrate for delicate semiconductor processes.
- Quality Assurance - Each wafer undergoes rigorous quality control and inspection to meet industry standards.
Major Applications:
FSM's 4-inch Borofloat glass wafers are versatile and can be used in various high-tech applications, including:
- Semiconductor processing and packaging
- MEMS (Micro-Electro-Mechanical Systems)
- Optoelectronics and photonics
- Sensor technology
- Biotechnology and medical devices
- Research and development
Our commitment to quality ensures that our Borofloat glass wafers provide the reliability and performance necessary for cutting-edge technology development.
Quantity Discounts:
FSM offers competitive pricing with quantity discounts for bulk orders. For orders of 100 wafers or more, please contact us to discuss customized pricing options tailored to your project's volume requirements.
Use reference value
| Item | Specification | ||
| Diameter | 150mm | 200mm | 300mm |
| Type | P/N | P/N | P/N |
| Notch | SEMI/JEIDA | Notch/OF | Notch |
| Thickness(μm) | 675±25/625±25 | 725±25 | 725±25 |
| Surface | Polished | Polished | Polished |
| Inside | Etched | Etched | Etched |
| Package | CoinRoll | CoinRoll | CoinRoll |
150MM/200MM Test wafer
| 150MM | ||
| SPEC | 0.2um≤30ea | |
| Diameter(mm) | 150±0.2mm | |
| Type | P | |
| Olyfra length | 57.5mm±2.5mm | 47.5mm±2.5mm |
| Resistance value ( Ω·cm ) | 1-100 | |
| Thickness(μm) | SEMI | JEIDA |
| 675um±25um | 675um±25um | |
| TTV(μm) | ≤30um | |
| BOW(μm) | ≤40um | |
| WARP(μm) | ≤40um | |
| Surface impurity | ≤5.0E 10 atom/cm² | |
| 200MM | ||
| SPEC | 0.2um≤30ea | - |
| Diameter(mm) | 200±0.2mm | |
| Type | P | |
| Crystal orientation | <110>±1 | |
| Notch direction | ||
| Resistance value ( Ω·cm ) | 1-100 | |
| Thickness(μm) | 725um±25um | |
| TTV(μm) | ≤25um | ≤2um |
| BOW(μm) | ≤40um | |
| WARP(μm) | ||
| LM | NO | |
| Surface impurity | ≤5.0E 10 atom/cm² | |
300MM Test wafer
| 300MM | ||||
| SPEC | 0.045um≤50ea | 0.065um≤50ea | 0.09um<50ea | 0.12um<50ea |
| Manufacturing method | CZ | |||
| Diameter(mm) | 300±0.2mm | |||
| Type/Dopant | P/Boron | |||
| Crystal orientation | <100>±1 | |||
| Notch direction | ||||
| Resistance value (Ω·cm) | 1-100 | |||
| Thickness(μm) | 775±25 | |||
| TTV(μm) | ≤10 | |||
| BOW(μm) | ≤40 | |||
| WARP(μm) | ||||
| LM | T7+ OCR | |||
| Surface impurity | <1 E10 Atoms/cm² | |||
200MM/300MM Oxide wafer
| 200MM | 300MM | |
| Oxide thickness | 500±25nm | |
| Variation in oxide thickness (for one wafer) | <3% | |
| Variation in oxide thickness (for multiple wafers) | <3% | |
| SPEC | 0.2μm≤30ea | |
| Diameter(mm) | 200±0.2mm | 300±0.2mm |
| Type | P | |
| Crystal orientation | <100>±1 | |
| Notch direction | <100>±1 | |
| Resistance value (Ω ·cm) | 1-100 | |
| Thickness(μm) | 725±25 | |
| TTV(μm) | ≤25 | ≤10 |
| BOW(μm) | ≤40 | |
| WARP(μm) | ≤40 | |
| Surface impurity | ≤5.0 E10 Atom/cm² | <1 E10 Atoms/cm² |
* Please contact us for other film types, film thickness, and film composition.
Q: What's the way of shipping ?
A: We accept DHL, Fedex, TNT, UPS, EMS, SF and etc.
Q: How to pay?
A: T/T, PayPal and etc..
Q: What's the deliver time?
A: For inventory: the delivery time is 5 workdays.
For customized products: the delivery time is 7 to 25 workdays. According to the quantity.
Q: Can I customize the products based on my need?
A: Yes, we can customize the material, specifications and optical coating for your optical components based on your needs.
Every customer's specification is unique and FSM can supply wafers that meet your exact specifications.
