Integrated Circuit Lead Fream disc selective silver plating equipment
Speed: 3-12m/min
Channel: 2
Accuracy: ±0.075mm
The way of unlaod and offload: Roll to Roll
Control way: Φ254-480mm Disc Die × 2SETS
Applicable product width: 10-110mm; thickness: 0.08-1.02mm
In view of the current multi-row and high-density lead frames, a comprehensive technical upgrade has been carried out in order to solve the problem as traditional production line has low good product rat and poor thickness unitormity.









FAQ
Q:Are you manufacturer or trading company ?
A:We are a professional manufacturer of large-scale research and production of semiconductor wet process equipment. We have a professional research and development team and production and assembly workshop, which can ensure quality and after-sales service.
Q:What is the width of the equipment ?
A:The width of the equipment is about two meters.
Q:How long is the warranty ?
A:The warranty period of our equipment is one year. One-step service, professional engineers to follow up to solve the problem.
A:Standard export fumigation sign wooden box packing or delivery by land or sea.
Q:how to install and debug the equipment after its arrival ?
A:After the equipment is issued, we will arrange a senior installation and debugging team to the your company to complete the installation,debugging,training,etc.,and assist your company in the early mass production.