Sn-3.0Ag-0.5Cu
Lead-Free Solder Paste
Tin
Containing Flux
Syringe Method Continuous out of Tin Stability
10-20mm
Grey
500g/Bottle
Customized
Omd
customized
Customized
250g 500g 1000g
China
3810100000
Product Description
GUANG DONG ZHONG SHI METALS CO.,LTD
Founded in 1999, high-tech enterprises, designated supplier of welding materials for national aerospace industries. registered capital 22 million, has passed the ISO9001, ISO14001 and QC080000 certification. Main products are solder paste, solder wire, solder bar, annual production capacity more than 6000 tons.

Product Advantages


Tin-lead solder wire

Solder paste

Solder bar

Other solder products

Product Parameters
Delivery Details : Usually 3-5 days for samples and 10-20 days for bulk orders.

A: We are a manufacturer with 20 years experience in the production of welding wire, welding bar and solder paste.
Founded in 1999, high-tech enterprises, designated supplier of welding materials for national aerospace industries. registered capital 22 million, has passed the ISO9001, ISO14001 and QC080000 certification. Main products are solder paste, solder wire, solder bar, annual production capacity more than 6000 tons.

Name | Lead-free solder paste |
Model | YF-1H-6337 |
Alloy | Sn-3.0Ag-0.5Cu |
Package | 500g/bottle |
Melting point | 240-243ºC |
Particles | 25 - 45um(custom made) |
Viscosity | 190±20Pa.S |

Lead-free solder wire

Tin-lead solder wire

Solder paste

Solder bar

Other solder products

Product Parameters
Type | Ingredient (WT%) | Melting point (ºC) | Application scenario |
Lead paste | Sn63Pb37 | 183 | Suitable for demanding circuit boards, such as: high-precision instruments, electronic industry, communications, micro-technology, aviation industry and other products welding |
Sn62.6Pb37Ag0.4 | 183-190 | ||
Sn60Pb40 | 183-203 | ||
Sn55Pb45 | 183-215 | Applicable to the requirements of ordinary circuit boards, such as: home appliances, electrical instrumentation, automotive electronics, hardware and electrical appliances and other products welding | |
Sn50Pb50 | 183-227 | ||
Sn45Pb55 | 183-238 | ||
Lead-free solder paste | Sn99Ag0.3Cu0.7 | 183-248 | Low cost, high melting point. Can be used for less demanding welding |
Sn96.5Ag3.0Cu0.5 | 183-258 | High cost, good performance, suitable for high-demand welding | |
Sn64.7Ag0.3Bi35 | 183-266 | Good performance, low melting point, and finer lattice alloys | |
Sn64Ag1.0Bi35 | 183-279 | High cost, good performance, commonly used lead-free solder | |
Sn42Bi58 | 227 | Prevent corrosion by CU, suitable for low temperature welding |
Packing Details : 500g/bottle,20bottle/box.
Delivery Details : Usually 3-5 days for samples and 10-20 days for bulk orders.

Our products have passed ROHS and REACH testing and certification. Each order can be accompanied by a batch of SGS certificate, material safety data sheet. The MSDS of this product can be obtained from our sales staff.

Q1: Are you Manufacturer or Trading company?