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Metallized Ceramic Substrates for RF Radio Frequency Applications

Price	$100.00 Compare
Min Order	100 Pieces
Shipping From	Guangdong, China
Popularity	277 people viewed
Quantity	+-

SHENZHEN JINGHUI INDUSTRY LIMITED

Audited Supplier 5 years

Profile Certified by SGS/BV

Guangdong, China
Andy Chen (Mr.)
Technical Sales Manager

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Product Detail

Model NO.:

Customized

Application:

Refractory, Structure Ceramic, Industrial Ceramic, Brazing

Material:

Alumina Ceramic

Product Name:

Ceramic Substrates for RF Application

Optional Purity:

96%, 99% and 99.5% Alumina

Color:

White, Beige, Pink

Surface Treatment:

Polished, Glazed

Norminal:

1% of Dimensions

Usage:

for Ceramic to Metal Joint Technology

Type:

Ceramic Parts

Trademark:

JingHui

Transport Package:

Vacuum Packaging with Desciant

Specification:

36cm x 20cm x 24cm

Origin:

China

HS Code:

8547100000

Product Description

Metallized Ceramic Substrates for RF Radio Frequency Applications

Direct Plated Copper (DPC) technology is a ceramic circuit processing technology developed on the basis of ceramic thin film processing. Differentfrom the traditional thick film and thin film processing technology, its processing strengthens the requirements of electrochemical processing. After the metallization of the ceramic surface is achieved by physical methods, the conductive copper and functional film layers are processed electrochemically.

Under the trend of intelligence, the application of DPC technology will be more common to meet the needs of miniaturization and high precision.

Jinghui's mature DPC technology can customize the thickness of metal circuits for you to meet your diverse needs.

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