Audited Supplier
Mo alloy
Aviation, Electronics, Industrial, Medical, Chemical
GB, ASTM
as Required
Alloy
Molybdenum Plate
Not Powder
Ground Polished
10-15 Days
ISO9001:2000
as Required
Professional
tongchang
Paper Boxes Wooden Case
as required
China
8102990000
Product Description
MoCu alloy is a kind of pseudo-alloy that is composed of molybdenum and copper. It consists of both the characteristics of molybdenum and copper, having high thermal conductivity, low adjusted thermal expansion coefficient, Beijing non-magnetic, low content of gas, good vacuum resistance, good machinability and special high-temperature performance, etc.
Compared with WCu alloy, MoCu alloy has lower density and is easier to stamp, It makes MoCu suitable for valume produce.
Our products
High quality with reasonable price
About FAQ
If you have any question,just feel free to say.We'll also provide you good after-sale service.
Company information
We have been exporting for more than 10 years,worthy of your trust.Hope there's a chance to establish friendly cooperation relations with you from all over the world.
Compared with WCu alloy, MoCu alloy has lower density and is easier to stamp, It makes MoCu suitable for valume produce.
| Product Brief Introduction: Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu. Surface: Plating Ni, NiAu, NiAg, or Non-plating | ||||||||||||||||||||||||||||||||||||
| Product Properties: Physical Properties of Major Products
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| Applications: These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc. |
| Product Brief Introduction: Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components. The features of copper molybdenum copper Large sized sheets available (length up to XXmm, width up to XXXmm) Can be stamped into components Strong interface bonding resist to 850ºC heat shock repeatedly Tailorable CTE matching that of semiconductor and ceramics High thermal conductivity | ||||||||||||||||||||||||||||||||
Product Properties:
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| Applications: Applications are similar with W-Cu composites. Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mounts. | ||||||||||||||||||||||||||||||||
| Product Brief Introduction: Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1:4:1. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components,. Features of Cu/Mo70Cu/Cu Large sized sheets available (length up to XXmm, width up to XXmm) More easily to be stamped into components than CMC Very strong interface bonding which can repeatedly resist 850ºC heat shock Higher thermal conductivity and lower cost | ||||||||||||||||||||||||||||||||
Product Properties:
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Our products
High quality with reasonable price
About FAQ
If you have any question,just feel free to say.We'll also provide you good after-sale service.
Company information
We have been exporting for more than 10 years,worthy of your trust.Hope there's a chance to establish friendly cooperation relations with you from all over the world.
