Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers

Price $200000.00 Compare
Min Order 1 set
Shipping From Shandong, China
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Yantai Likai Numerical Control Technology Co., Ltd.

VIP   Audited Supplier 1 year
Profile Certified by SGS/BV
DA600
on-Site Installation, Commissioning and Training
12 Months After Acceptance
New
CE, ISO 9001: 2015
Automatic
Aluminum, Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
205X205X600mm
2400m/Min
Provide Test Cut Service
4300X1650X3300mm
13000kg
LiKai
Wooden Case
China
8464109000
Product Description

Product Description


DA600 Multi-wire Saw


This series is mainly used for high-precision cutting of silicon carbide crystals, with advantages of large loading capacity and high wire speed ensuring high precision and high reliability, and achieving a significant increase in production capacity.

It can cut materials in 4~8 inches, the cutting size is flexible according to customers' requirements.
 

Product Features

 

>Processing Size
3 wire guide rollers, the maximum processing size can be 8 inches.
>Flexibility
The cutting wire can be flexibly change between slurry and diamond wire to meet different requirements from customers.

>Stability

The take-up and pay-off spools are under the cutting room, it's more stable during machine running.

>High-speed Cutting
The machine is equipped with an upside-down swing cutting structure, which facilitates high-speed sheet cutting.

>Stable Wire Arrangement System
Better design of the guide wheel distance and high-precision detection of wire arrangement, reduce the risk of wire breakage.

>Advanced Tension System
More advanced tension control algorithm and high precision tension sensor.

 

Cut Samples

 

 

Product Parameters

DetailParameter
ModelDA600
Maximum work sizeφ205x600mm

Workbench quantity

1
Roller out diameter*Workable width(φ200±10mm)x610x3

Wire diameter

φ0.10-φ0.25mm
Wire spool storage40km(φ0.25mm)
Maximum running speed2400m/min
Travel of table300mm
Table swing±10°
Cutting methodVertically downward movement
Cutting feed speed0.1-99.9mm/min
Tension range5-50N
Tension system accuracy(during cutting)±0.5N
Cutting fluidWater-based cutting fluid
Fluid storage420L
Fluid flow rate12000L/H
Power supply380V±10%  50HZ
Power120Kw
Air supply≥0.4MPa
Size L*W*H4300x1650x3300mm
Weight13000kg

 

About Us

FAQ

1. What Materials Could The Multi-Wire Saws Cut?
    Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. 
What's The Size Range Of The Cut Product?
    The maximum diameter of the cut material is up to 1000mm.
    The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
   
±10μm. It's subject to the cut material, please consult us for actual data.
4. 
Which Countries The Equipments Have Been Exported To?
    The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.


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