Audited Supplier
9104
12months
12months
Surface Grinding Machine
Flat Workpieces
Grinding Wheel
PLC
Semiautomatic
Surface Grinding Machine
High Precision
ISO 9001
New
Electricity
with Variable Speed
Metal&Nonmetal
Grinding Industry
Buffing Pads
Metal and Non-Metal
Φ 910mm
Oversea Setup & After-Sale Avalaible
Single Plate
3
Pneumatic or Weight Block
Metal & Non-Metal
Slurry
PONDA
Wood Crate
750*700*700mm
China
Product Description
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
Applicable to ceramic, sapphire, various crystal materials, aluminum alloy, stainless steel and other metal and non-metallic materials grinding, polishing.
Wafer Lapping & CMP Series
Wafer lapping & CMP series is specially advanced version of the regular with lifting structure, professionalized in wafer lapping and CMP. The high-end series newly consists of infrared temperature sensor, plate cooling system and vacuum system, and allows user to operate each station individually thru GUI control panel. Besides the added functions, the upgraded mechanical parts such as motors, bearings and low-CTE materials have ability to attain higher performance than the regular.
When to process lapping and CMP
As when the wafer made of inflexible materials like SiC and sapphire(Al2O3) is too tough against abrasive especially of fine grinding, the lapping becomes competent for removal of thickness and the spiral grooves. CMP comes after lapping and fine grinding confidently. The purpose of polishing guarantees declined rate of wafer fragmentation when transporting because it greatly strengthens toughness by stress relief, also to provide convenience for subsequent fabrication because of increased roughness.
APPLICATION
SPECIFICATION
SAMPLE DEMONSTRATION (SINGLE PLATE)
Patent
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
Applicable to ceramic, sapphire, various crystal materials, aluminum alloy, stainless steel and other metal and non-metallic materials grinding, polishing.Wafer Lapping & CMP Series
Wafer lapping & CMP series is specially advanced version of the regular with lifting structure, professionalized in wafer lapping and CMP. The high-end series newly consists of infrared temperature sensor, plate cooling system and vacuum system, and allows user to operate each station individually thru GUI control panel. Besides the added functions, the upgraded mechanical parts such as motors, bearings and low-CTE materials have ability to attain higher performance than the regular.
When to process lapping and CMP
As when the wafer made of inflexible materials like SiC and sapphire(Al2O3) is too tough against abrasive especially of fine grinding, the lapping becomes competent for removal of thickness and the spiral grooves. CMP comes after lapping and fine grinding confidently. The purpose of polishing guarantees declined rate of wafer fragmentation when transporting because it greatly strengthens toughness by stress relief, also to provide convenience for subsequent fabrication because of increased roughness.
APPLICATION
| Process | Industry by Substance | Industry by Applicability | |
| High Speed Grinding & Thinning | Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone | Sealing | sealing ring(liquid, oil, gas) |
| Semiconductor | substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc | ||
| Plastic | Hard Plastic | ||
| Optics(flat) | optical lens, optical reflector, holographic glass, HUD glass, screen glass | ||
| Gemstone | jade, sapphire, agate, etc. | ||
| Others | gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware. | ||
| *NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed. | |||
SPECIFICATION
| Standard Specification | ||||
| Machine Model | FD7104XA | FD9104XA | ||
| Plate Diameter | Φ700*250*12MM | Φ910*250*12MM | ||
| Max. Workpiece Diameter (without conditioning ring) | Φ305 mm | Φ400 mm | ||
| Conditioning Ring Diameter | Φ305 mm | Φ400 mm | ||
| Drive cylinder | 4 | 4 | ||
| Plate Rotate Speed | 5-90rpm | 5-90 rpm | ||
| Rotating speed of working disk | 5-40RPM | 5-40RPM | ||
| Main motor power | 7.5KW/three-phase (physics)380V | 7.5KW/three-phase (physics)380V | ||
| Drive motor power | 0.4kw | 0.4kw | ||
| Facing machine power | 0.4kw | 0.4kw | ||
| Total Weight | 2000 kg | 2500 kg | ||
| Total Floor Space | 1050×1650X2300 mm | 1200X1800X2300mm | ||
SAMPLE DEMONSTRATION (SINGLE PLATE)
Patent
About the Company
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people
Delivery and packing
Packing Instructions: Packing, 1 / wooden box.
Packing Instructions: Packing, 1 / wooden box.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
