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RF 1.0GHz to 2.0GHz Coaxial Isolator

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Min Order	10 Pieces
Shipping From	Sichuan, China
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Chengdu Hzbeat Electronic Technology Co., Ltd.

Audited Supplier 3 years

Profile Certified by SGS/BV

Sichuan, China
Keith Wang (Mr.)

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Product Detail

Model NO.:

HCITA10T20G

Insertion Loss(dB)Max:

0.7

Isolation(dB)Min:

16.0

Vswr Max:

1.5

Connector:

SMA-K

Specification:

56*60(mm)

Product Description

Product description:

0.05 GHz to 40.0 GHz Coaxial Isolator

Coaxial Isolator
Number	Wave band	Model	Frequency(GHz)	BW Max	Insertion loss(dB) Max	Isolation(dB)Max	VSWR Max	Direction	Size(mm)	Connector	Operating temperature(ºC)
1	VHP	HCITA50T250M	0.05~0.25	10%	0.4	20	1.2	clockwise	100*114	N-K	-55~+85ºC
2	VHP	HCITB50T250M	0.05~0.25	10%	0.4	20	1.2	Counter Clockwise	100*114	N-K	-55~+85ºC
3	VHF-P	HCITA01T04G	0.1~0.4	10%	0.4	20	1.2	clockwise	100*100	SMA-K/SMA-J	-55~+85ºC
4		HCITB01T04G	0.1~0.4	10%	0.4	20	1.2	Counter Clockwise	100*100	SMA-K/SMA-J	-55~+85ºC
5		HCITA01T04G	0.1~0.4	40%	0.6	15	1.5	clockwise	100*100	SMA-K	-55~+85ºC
6		HCITB01T04G	0.1~0.4	40%	0.6	15	1.5	Counter Clockwise	100*100	SMA-K	-55~+85ºC
7		HCITA02T05G	0.2~0.5	10%	0.4	20	1.2	clockwise	62*76	N-K	-55~+85ºC
8		HCITB02T05G	0.2~0.5	10%	0.4	20	1.2	Counter Clockwise	62*76	N-K	-55~+85ºC
9		HCITA02T06G	0.2~0.6	10%	0.4	20	1.2	clockwise	62*62	SMA-K/SMA-J	-55~+85ºC
10		HCITB02T06G	0.2~0.6	10%	0.4	20	1.2	Counter Clockwise	62*62	SMA-K/SMA-J	-55~+85ºC
11	P	HCITA03T06G	0.3~0.6	40%	0.6	15	1.5	clockwise	62*62	SMA-K	-55~+85ºC
12		HCITB03T06G	0.3~0.6	40%	0.6	15	1.5	Counter Clockwise	62*62	SMA-K	-55~+85ºC
13		HCITA04T10G	0.4~1	10%	0.4	20	1.2	clockwise	46*46	SMA-K/SMA-J	-55~+85ºC
14		HCITB04T10G	0.4~1	10%	0.4	20	1.2	Counter Clockwise	46*46	SMA-K/SMA-J	-55~+85ºC
15		HCITA04T10G	0.4~1	10%	0.4	20	1.2	clockwise	46*60	N-K	-55~+85ºC
16		HCITB04T10G	0.4~1	10%	0.4	20	1.2	Counter Clockwise	46*60	N-K	-55~+85ºC
17		HCITA05T10G	0.5~1	40%	0.6	15	1.5	clockwise	46*46	SMA-K	-55~+85ºC
18		HCITB05T10G	0.5~1	40%	0.6	15	1.5	Counter Clockwise	46*46	SMA-K	-55~+85ºC
19	P-S	HCITA08T25G	0.8~2.5	10%	0.4	20	1.2	clockwise	19*14.6	SMA-K/SMA-J	-55~+85ºC
20	P-S	HCITB08T25G	0.8~2.5	10%	0.4	20	1.2	Counter Clockwise	19*14.6	SMA-K/SMA-J	-55~+85ºC
21	P-C	HCITA08T60G	0.8~6	10%	0.4	20	1.2	clockwise	25*38	N-K	-55~+85ºC
22	P-C	HCITB08T60G	0.8~6	10%	0.4	20	1.2	Counter Clockwise	25*38	N-K	-55~+85ºC
23	L	HCITA10T20G	1~2	FULL	0.7	16	1.5	clockwise	56*56	SMA-K	-20~+60ºC
24		HCITB10T20G	1~2	FULL	0.7	16	1.5	Counter Clockwise	56*56	SMA-K	-20~+60ºC
25		HCITA10T20G	1~2	FULL	1	14	1.6	clockwise	56*56	SMA-K	-20~+60ºC
26		HCITB10T20G	1~2	FULL	1	14	1.6	Counter Clockwise	56*56	SMA-K	-20~+60ºC
27		HCITA10T20G	1~2	FULL	0.7	16	1.5	clockwise	56*56	SMA-K	0~+60ºC
28		HCITB10T20G	1~2	FULL	0.7	16	1.5	Counter Clockwise	56*56	SMA-K	0~+60ºC
29		HCITA10T20G	1~2	FULL	1	14	1.6	clockwise	56*56	SMA-K	0~+60ºC
30		HCITB10T20G	1~2	FULL	1	14	1.6	Counter Clockwise	56*56	SMA-K	0~+60ºC
31	L-S	HCITA15T35G	1.5~3.5	10%	0.4	20	1.2	clockwise	25*25	SMA-K/SMA-J	-55~+85ºC
32	L-S	HCITB15T35G	1.5~3.5	10%	0.4	20	1.2	Counter Clockwise	25*25	SMA-K/SMA-J	-55~+85ºC
33	S	HCITA20T40G	2~4	FULL	0.5	17	1.4	clockwise	30.5*34.5	SMA-K	-20~+60ºC
34		HCITB20T40G	2~4	FULL	0.5	17	1.4	Counter Clockwise	30.5*34.5	SMA-K	-20~+60ºC
35		HCITA20T40G	2~4	FULL	0.8	15	1.5	clockwise	30.5*34.5	SMA-K	-20~+60ºC
36		HCITB20T40G	2~4	FULL	0.8	15	1.5	Counter Clockwise	30.5*34.5	SMA-K	-20~+60ºC
37		HCITA20T40G	2~4	FULL	0.5	17	1.4	clockwise	30.5*34.5	SMA-K	-20~+60ºC
38		HCITB20T40G	2~4	FULL	0.5	17	1.4	Counter Clockwise	30.5*34.5	SMA-K	-20~+60ºC
39		HCITA20T40G	2~4	FULL	0.8	15	1.5	clockwise	30.5*34.5	SMA-K	-20~+60ºC
40		HCITB20T40G	2~4	FULL	0.8	15	1.5	Counter Clockwise	30.5*34.5	SMA-K	-20~+60ºC
41	S-C	HCITA20T60G	2~6	FULL	1	11	1.7	clockwise	30.5*34.5	SMA-K	-20~+60ºC
42		HCITB20T60G	2~6	FULL	1	11	1.7	Counter Clockwise	30.5*34.5	SMA-K	-20~+60ºC
43		HCITA20T60G	2~6	FULL	1.2	10	1.8	clockwise	30.5*34.5	SMA-K	-20~+60ºC
44		HCITB20T60G	2~6	FULL	1.2	10	1.8	Counter Clockwise	30.5*34.5	SMA-K	-20~+60ºC
45		HCITA20T60G	2~6	FULL	1	11	1.7	clockwise	30.5*34.5	SMA-K	-20~+60ºC
46		HCITB20T60G	2~6	FULL	1	11	1.7	Counter Clockwise	30.5*34.5	SMA-K	-20~+60ºC
47		HCITA20T60G	2~6	FULL	1.2	10	1.8	clockwise	30.5*34.5	SMA-K	-20~+60ºC
48		HCITB20T60G	2~6	FULL	1.2	10	1.8	Counter Clockwise	30.5*34.5	SMA-K	-20~+60ºC
49		HCITA30T50G	3~5	10%	0.4	20	1.2	clockwise	21*25	SMA-K/SMA-J	-55~+85ºC
50		HCITB30T50G	3~5	10%	0.4	20	1.2	Counter Clockwise	21*25	SMA-K/SMA-J	-55~+85ºC
51	S-X	HCITA30T120G	3~12	10%	0.4	20	1.2	clockwise	19*26	N-K	-40~+70ºC
52	S-X	HCITB30T120G	3~12	10%	0.4	20	1.2	Counter Clockwise	19*26	N-K	-40~+70ºC
53	C	HCITA40T80G	4~8	10%	0.4	20	1.2	clockwise	17*27	SMA-K/SMA-J	-55~+85ºC
54		HCITB40T80G	4~8	10%	0.4	20	1.2	Counter Clockwise	17*27	SMA-K/SMA-J	-55~+85ºC
55		HCITA40T80G	4~8	FULL	0.4	18	1.35	clockwise	19*19	SMA-K	-40~+70ºC
56		HCITB40T80G	4~8	FULL	0.4	18	1.35	Counter Clockwise	19*19	SMA-K	-40~+70ºC
57		HCITA40T80G	4~8	FULL	0.5	17	1.4	clockwise	19*19	SMA-K	-40~+70ºC
58		HCITB40T80G	4~8	FULL	0.5	17	1.4	Counter Clockwise	19*19	SMA-K	-40~+70ºC
59		HCITA40T80G	4~8	FULL	0.4	18	1.35	clockwise	19*19	SMA-K	-40~+70ºC
60		HCITB40T80G	4~8	FULL	0.4	18	1.35	Counter Clockwise	19*19	SMA-K	-40~+70ºC
61		HCITA40T80G	4~8	FULL	0.5	17	1.4	clockwise	19*19	SMA-K	-40~+70ºC
62		HCITB40T80G	4~8	FULL	0.5	17	1.4	Counter Clockwise	19*19	SMA-K	-40~+70ºC
63	C-Ku	HCITA60T180G	6~18	FULL	1.2	11	1.7	clockwise	13*22.5	SMA-K	-20~+60ºC
64		HCITB60T180G	6~18	FULL	1.2	11	1.7	Counter Clockwise	13*22.5	SMA-K	-20~+60ºC
65		HCITA60T180G	6~18	FULL	1.5	10	1.8	clockwise	13*22.5	SMA-K	-20~+60ºC
66		HCITB60T180G	6~18	FULL	1.5	10	1.8	Counter Clockwise	13*22.5	SMA-K	-20~+60ºC
67		HCITA60T180G	6~18	FULL	1.2	11	1.7	clockwise	13*22.5	SMA-K	-20~+60ºC
68		HCITB60T180G	6~18	FULL	1.2	11	1.7	Counter Clockwise	13*22.5	SMA-K	-20~+60ºC
69		HCITA60T180G	6~18	FULL	1.5	10	1.8	clockwise	13*22.5	SMA-K	-20~+60ºC
70		HCITB60T180G	6~18	FULL	1.5	10	1.8	Counter Clockwise	13*22.5	SMA-K	-20~+60ºC
71	X-K	HCITA80T190G	8~19	10%	0.4	20	1.25	clockwise	13*26	SMA-K/SMA-J	-55~+85ºC
72	X-K	HCITB80T190G	8~19	10%	0.4	20	1.25	Counter Clockwise	13*26	SMA-K/SMA-J	-55~+85ºC
73	K	HCITA180T265G	18~26.5	FULL	1	14	1.5	clockwise	10*25	2.92-K	-55~+85ºC
74		HCITB180T265G	18~26.5	FULL	1	14	1.5	Counter Clockwise	10*25	2.92-K	-55~+85ºC
75		HCITA180T265G	18~26.5	FULL	1	14	1.5	clockwise	10*25	2.92-K	-55~+85ºC
76		HCITB180T265G	18~26.5	FULL	1	14	1.5	Counter Clockwise	10*25	2.92-K	-55~+85ºC
77	K-Ka	HCITA180T400G	18~40	10%	0.6	18	1.35	clockwise	10*25	SMA-K/SMA-J	-55~+85ºC
78	K-Ka	HCITB180T400G	18~40	10%	0.6	18	1.35	Counter Clockwise	10*25	SMA-K/SMA-J	-55~+85ºC

Custom Design:

Applications:

Wireless Communication Base Station

Radar System

RF Circuit

Microwave Radio Systems

T/R Module

GPS

Cavity Filter

Public Address System Radio Transmitter

Satellite TV

Mounting instructions for microstrip Components:

Storage : Components must be kept in a dry and protected environment. (Such as nitrogen gas cabinet or drying cabinet).
Normal operation : In the purification environment, it is necessary to wear dust-free finger covers and use plastic head or bamboo tweezers to avoid colliding with the substrate and scratching the microstrip line during operation.
Cleaning treatment : The components can be cleaned in absolute ethanol, and can also be gently wiped with absolute ethanol cotton balls. It is strictly forbidden to clean in an ultrasonic cleaner.
Installation :
* Soldering process. The components installation is recommended to use the soldering material which melting temp. is ≤183 ºC. Such as solder paste Sn63Pb37 or solder sheet. Use the heating table for soldering. After the solder fully melted at 200ºC and remove the components. The continuous time should< 30 seconds.
* Adhesion process: Use less and smooth conducting resin. It is finished when conductive adhesive can be seen around the component after it is placed in the installation position and pressed tightly. The curing temperature is less than 140ºC for baking.
Port connection :

Bonding method: Gold bonding wire is recommended to use 25μm, thermosonic bonding temperature is 100 ~ 150ºC, spherical bonding wedge pressure is 30 ~ 55gf, shaped bonding wedge pressure is 15 ~ 25gf.
Tin soldering method: Place the box installed microstrip components on the 120 ºC heating box to preheat. It is recommended to use the soldering material which melting temp. is ≤183 ºC, preload the gold-plated copper foil connection line into a certain arc and lap coat the microstrip line with flux. Use the pointed soldering iron to solder the connection line in turn, soldering iron setting temperature is 210 ºC ~ 230 ºC,soldering time less than 2 seconds per time, solder as little as possible and keep solder joints smooth and round. Generally, we don't recommend soldering for lead wires.

Assembly diagram :
(1): The installation hole (slot) size of the components shall be controlled as follows: length x width x height.

(2): Unilateral assembly gap of components should be <0.05mm.

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