RF 18.0GHz to 22.0GHz Microstrip Isolator

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Chengdu Hzbeat Electronic Technology Co., Ltd.

VIP   Audited Supplier 3 years
Profile Certified by SGS/BV
HMIA180T220A
0.5
20
1.25
4.5*5.5(mm)
Product Description
Product description:



2.7 GHz to 43.0 GHz Microstrip Isolators
 Microstrip Isolators(General)
NumberWave bandModelFrequency(GHz)BW MaxInsertion loss(dB) MaxIsolation(dB)MaxVSWR MaxDirectionSize(mm)Operating temperature(ºC)
1SHMIA27T35A2.7-3.5FULL0.6201.3clockwise14*16-55~+85ºC
2HMIB27T35A2.7-3.5FULL0.6201.3counter clockwise14*16-55~+85ºC
3HMIA30T40A3.0-4.0FULL0.5181.3clockwise12*12-55~+85ºC
4HMIB30T40A3.0-4.0FULL0.5181.3counter clockwise12*12-55~+85ºC
5HMIA31T39B3.1-3.9FULL0.6181.3clockwise12*12-55~+85ºC
6HMIA31T39A3.1-3.9FULL0.6181.3counter clockwise12*12-55~+85ºC
7HMIA35T45B3.5-4.5FULL0.6181.3clockwise12*12-55~+85ºC
8HMIB35T45B3.5-4.5FULL0.6181.3counter clockwise12*12-55~+85ºC
9HMIA35T55A3.5-5.5FULL0.6161.3clockwise12*12-55~+85ºC
10HMIB35T55A3.5-5.5FULL0.6161.3counter clockwise12*12-55~+85ºC
11CHMIA40T50A4.0-5.0FULL0.5201.25clockwise12*12-55~+85ºC
12HMIB40T50A4.0-5.0FULL0.5201.25counter clockwise12*12-55~+85ºC
13HMIA45T55A4.5-5.5FULL0.5201.25clockwise12*12-55~+85ºC
14HMIB45T55A4.5-5.5FULL0.5201.25counter clockwise12*12-55~+85ºC
15HMIA50T60B5.0-6.0FULL0.5201.25clockwise10*10-55~+85ºC
16HMIB50T60B5.0-6.0FULL0.5201.25counter clockwise10*10-55~+85ºC
17HMIA55T65B5.5-6.5FULL0.5201.25clockwise10*10-55~+85ºC
18HMIB55T65B5.5-6.5FULL0.5201.25counter clockwise10*10-55~+85ºC
19HMIA65T75B6.5-7.5FULL0.5201.25clockwise10*10-55~+85ºC
20HMIB65T75B6.5-7.5FULL0.5201.25counter clockwise10*10-55~+85ºC
21HMIA60T80B6.0-8.0FULL0.6181.3clockwise10*10-55~+85ºC
22HMIB60T80A6.0-8.0FULL0.6181.3counter clockwise10*10-55~+85ºC
23HMIA50T80C5.0-8.0FULL0.6181.3clockwise10*10-55~+85ºC
24HMIB50T80C5.0-8.0FULL0.6181.3counter clockwise10*10-55~+85ºC
25HMIA70T95D7.0-9.5FULL0.6171.35clockwise7*8-55~+85ºC
26HMCB70T95D7.0-9.5FULL0.6171.35counter clockwise7*8-55~+85ºC
27XHMIA75T95A7.5-9.5FULL0.6201.25clockwise7*8-55~+85ºC
28HMIB75T95A7.5-9.5FULL0.6201.25counter clockwise7*8-55~+85ºC
29HMIA80T120B8.0-12.0FULL0.5181.3clockwise6.5*7.5-55~+85ºC
30HMIB80T120B8.0-12.0FULL0.5181.3counter clockwise6.5*7.5-55~+85ºC
31HMIA80T120C8.0-12.0FULL0.6181.35clockwise6*7-55~+85ºC
32HMIB80T120C8.0-12.0FULL0.6181.35counter clockwise6*7-55~+85ºC
33HMIA80T100C8.0-10.0FULL0.5201.25clockwise6*7-55~+85ºC
34HMIB80T100C8.0-10.0FULL0.5201.25counter clockwise6*7-55~+85ºC
35HMIA85T105C8.5-10.5FULL0.5201.25clockwise6*7-55~+85ºC
36HMIB85T105C8.5-10.5FULL0.5201.25counter clockwise6*7-55~+85ºC
37HMIA90T110C9.0-11.0FULL0.5201.25clockwise6*7-55~+85ºC
38HMIB90T110C9.0-11.0FULL0.5201.25counter clockwise6*7-55~+85ºC
39HMIA100T120C10.0-12.0FULL0.5201.25clockwise6*7-55~+85ºC
40HMIB100T120C10.0-12.0FULL0.5201.25counter clockwise6*7-55~+85ºC
41HMIA110T130C11.0-13.0FULL0.5201.25clockwise6*7-55~+85ºC
42HMIB110T130C11.0-13.0FULL0.5201.25counter clockwise6*7-55~+85ºC
43KuHMIA120T150A12.0-15.0FULL0.5181.3clockwise6*7-55~+85ºC
44HMIB120T150A12.0-15.0FULL0.5181.3counter clockwise6*7-55~+85ºC
45HMIA120T180A12.0-18.0FULL0.7161.4clockwise6*7-55~+85ºC
46HMIB120T180A12.0-18.0FULL0.7161.4counter clockwise6*7-55~+85ºC
47HMIA140T180B14.0-18.0FULL0.5201.25clockwise5*6-55~+85ºC
48HMIB140T180B14.0-18.0FULL0.5201.25counter clockwise5*6-55~+85ºC
49HMIA150T200B15.0-20.0FULL0.6181.3clockwise5*6-55~+85ºC
50HMIB150T200B15.0-20.0FULL0.6181.3counter clockwise5*6-55~+85ºC
51KHMIA180T220A18.0-22.0FULL0.5201.25clockwise4.5*5.5-55~+85ºC
52HMIB180T220A18.0-22.0FULL0.5201.25counter clockwise4.5*5.5-55~+85ºC
53HMIA180T240A18.0-24.0FULL0.6181.3clockwise4.5*5.5-55~+85ºC
54HMIB180T240A18.0-24.0FULL0.6181.3counter clockwise4.5*5.5-55~+85ºC
55HMIA240T280A24.0-28.0FULL0.7181.3clockwise4.5*5.5-55~+85ºC
56HMIB240T280A24.0-28.0FULL0.7181.3counter clockwise4.5*5.5-55~+85ºC
57KaHMIA280T320B28.0-32.0FULL0.8171.35clockwise3.5*4.5-55~+85ºC
58HMIB280T320B28.0-32.0FULL0.8171.35counter clockwise3.5*4.5-55~+85ºC
59HMIA330T370B33.0-37.0FULL0.7201.35clockwise3.5*4.5-55~+85ºC
60HMIB330T370B33.0-37.0FULL0.7201.35counter clockwise3.5*4.5-55~+85ºC
61HMCA320T380B32.0-38.0FULL0.8181.4clockwise3.5*4.5-55~+85ºC
62HMIB320T380A32.0-38.0FULL0.8181.4counter clockwise3.5*4.5-55~+85ºC
63HMIA320T400B32.0-40.0FULL1141.4clockwise3.5*4.5-55~+85ºC
64HMIB320T400B32.0-40.0FULL1141.4counter clockwise3.5*4.5-55~+85ºC
65HMIA380T400B38.0-40.0FULL0.7201.35clockwise3.5*4.5-55~+85ºC
66HMIB380T400B38.0-40.0FULL0.7201.35counter clockwise3.5*4.5-55~+85ºC
67HMIA380T430A38.0-43.0FULL1.4141.5clockwise4*4.5-55~+85ºC
68HMIB380T430A38.0-43.0FULL1.4141.5counter clockwise4*4.5-55~+85ºC

 

 
Custom Design:
 
Applications:
 
Wireless Communication Base Station
 
Radar System
 
RF Circuit
 
Microwave Radio Systems
 
T/R Module
 
GPS
 
Cavity Filter
 
Public Address System Radio Transmitter
 
Satellite TV



 


Mounting instructions for microstrip Components:

Storage : Components must be kept in a dry and protected environment. (Such as nitrogen gas cabinet or drying cabinet).
Normal operation : In the purification environment, it is necessary to wear dust-free finger covers and use plastic head or bamboo tweezers to avoid colliding with the substrate and scratching the microstrip line during operation.
Cleaning treatment : The components can be cleaned in absolute ethanol, and can also be gently wiped with absolute ethanol cotton balls. It is strictly forbidden to clean in an ultrasonic cleaner.
Installation :
* Soldering process. The components installation is recommended to use the soldering material which melting temp. is ≤183 ºC. Such as solder paste Sn63Pb37 or solder sheet. Use the heating table for soldering. After the solder fully melted at 200ºC and remove the components. The continuous time should< 30 seconds.
* Adhesion process: Use less and smooth conducting resin. It is finished when conductive adhesive can be seen around the component after it is placed in the installation position and pressed tightly. The curing temperature is less than 140ºC for baking.
Port connection :
  • Bonding method: Gold bonding wire is recommended to use 25μm, thermosonic bonding temperature is 100 ~ 150ºC, spherical bonding wedge pressure is 30 ~ 55gf, shaped bonding wedge pressure is 15 ~ 25gf.
  • Tin soldering method: Place the box installed microstrip components on the 120 ºC heating box to preheat. It is recommended to use the soldering material which melting temp. is ≤183 ºC, preload the gold-plated copper foil connection line into a certain arc and lap coat the microstrip line with flux. Use the pointed soldering iron to solder the connection line in turn, soldering iron setting temperature is 210 ºC ~ 230 ºC,soldering time less than 2 seconds per time, solder as little as possible and keep solder joints smooth and round. Generally, we don't recommend soldering for lead wires.
Assembly diagram :
(1): The installation hole (slot) size of the components shall be controlled as follows: length x width x height.

(2): Unilateral assembly gap of components should be <0.05mm.

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