RF 2.8GHz to 3.6GHz Microstrip Circulator

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Min Order 10 Pieces
Shipping From Sichuan, China
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Chengdu Hzbeat Electronic Technology Co., Ltd.

VIP   Audited Supplier 3 years
Profile Certified by SGS/BV
HMCTA28T36G
0.6
18.0
1.30
14*14(mm)
Product Description
Product description:



2.7 GHz to 32.0 GHz Microstrip Isolators
Microstrip Circulators
NumberWave bandModelFrequency(GHz)BW MaxInsertion loss(dB) MaxIsolation(dB)MaxVSWR MaxDirectionSize(mm)Operating temperature(ºC) 
1SHMCTA27T35G2.7~3.5FULL0.6181.3clockwise14*14-55~+85ºC 
2HMCTB27T35G2.7~3.5FULL0.6181.3Counter Clockwise14*14-55~+85ºC 
3HMCTA28T36G2.8~3.6FULL0.6181.3clockwise14*14-55~+85ºC 
4HMCTB28T36G2.8~3.6FULL0.6181.3Counter Clockwise14*14-55~+85ºC 
5HMCTA29T32G2.9~3.2FULL0.5181.3clockwise14*14-55~+85ºC 
6HMCTB29T32G2.9~3.2FULL0.5181.3Counter Clockwise14*14-55~+85ºC 
7HMCTA31T39G3.1~3.9FULL0.6181.3clockwise12*12-55~+85ºC 
8HMCTB31T39G3.1~3.9FULL0.6181.3Counter Clockwise12*12-55~+85ºC 
9HMCTA30T40G3~4FULL0.5181.3clockwise14*14-55~+85ºC 
10HMCTB30T40G3~4FULL0.5181.3Counter Clockwise14*14-55~+85ºC 
11S-CHMCTA35T45G3.5~4.5FULL0.5201.25clockwise12*12-55~+85ºC 
12HMCTB35T45G3.5~4.5FULL0.5201.25Counter Clockwise12*12-55~+85ºC 
13CHMCTA40T50G4~5FULL0.5201.25clockwise12*12-55~+85ºC 
14HMCTB40T50G4~5FULL0.5201.25Counter Clockwise12*12-55~+85ºC 
15HMCTA48T54G4.8~5.4FULL0.5201.25clockwise10*10-55~+85ºC 
16HMCTB48T54G4.8~5.4FULL0.5201.25Counter Clockwise10*10-55~+85ºC 
17HMCTA50T60G5~6FULL0.5201.25clockwise9*9-55~+85ºC 
18HMCTB50T60G5~6FULL0.5201.25Counter Clockwise9*9-55~+85ºC 
19HMCTA50T80G5~8FULL0.7151.35clockwise10*10-55~+85ºC 
20HMCTB50T80G5~8FULL0.7151.35Counter Clockwise10*10-55~+85ºC 
21C-XHMCTA70T95G7~9.5FULL0.6161.35clockwise7*7-55~+85ºC 
22HMCTB70T95G7~9.5FULL0.6161.35Counter Clockwise7*7-55~+85ºC 
23HMCTA75T95G7.5~9.5FULL0.6181.3clockwise7*7-55~+85ºC 
24HMCTB75T95G7.5~9.5FULL0.6181.3Counter Clockwise7*7-55~+85ºC 
27XHMCTA85T105G8.5~10.5FULL0.5201.25clockwise6*6-55~+85ºC 
28HMCTB85T105G8.5~10.5FULL0.5201.25Counter Clockwise6*6-55~+85ºC 
29HMCYA85T105G8.5~10.5FULL0.5201.25clockwise6*6-55~+85ºC 
30HMCYB85T105G8.5~10.5FULL0.5201.25Counter Clockwise6*6-55~+85ºC 
31HMCTA80T120G8~12FULL0.5181.3clockwise6.5*6.5-55~+85ºC 
32HMCTB80T120G8~12FULL0.5181.3Counter Clockwise6.5*6.5-55~+85ºC 
33HMCYA80T120G8~12FULL0.5181.3clockwise6.5*6.5-55~+85ºC 
34HMCYB80T120G8~12FULL0.5181.3Counter Clockwise6.5*6.5-55~+85ºC 
35HMCTA80T120G8~12FULL0.6161.35clockwise6*6-55~+85ºC 
36HMCTB80T120G8~12FULL0.6161.35Counter Clockwise6*6-55~+85ºC 
37HMCYA80T120G8~12FULL0.6161.35clockwise6*6-55~+85ºC 
38HMCYB80T120G8~12FULL0.6161.35Counter Clockwise6*6-55~+85ºC 
39HMCTA90T120G9~12FULL0.5201.25clockwise6*6-55~+85ºC 
40HMCTB90T120G9~12FULL0.5201.25Counter Clockwise6*6-55~+85ºC 
41HMCYA90T120G9~12FULL0.5201.25clockwise6*6-55~+85ºC 
42HMCYB90T120G9~12FULL0.5201.25Counter Clockwise6*6-55~+85ºC 
43X-KuHMCTA110T130G11~13FULL0.5201.25clockwise6*6-55~+85ºC 
44HMCTB110T130G11~13FULL0.5201.25Counter Clockwise6*6-55~+85ºC 
45HMCYA110T130G11~13FULL0.5201.25clockwise6*6-55~+85ºC 
46HMCYB110T130G11~13FULL0.5201.25Counter Clockwise6*6-55~+85ºC 
47KuHMCTA120T150G12~15FULL0.5181.3clockwise6*6-55~+85ºC 
48HMCTB120T150G12~15FULL0.5181.3Counter Clockwise6*6-55~+85ºC 
49HMCYA120T150G12~15FULL0.5181.3clockwise6*6-55~+85ºC 
50HMCYB120T150G12~15FULL0.5181.3Counter Clockwise6*6-55~+85ºC 
51HMCTA140T160G14~16FULL0.5201.3clockwise5*5-55~+85ºC 
52HMCTB140T160G14~16FULL0.5201.3Counter Clockwise5*5-55~+85ºC 
53HMCYA140T160G14~16FULL0.5201.3clockwise5*5-55~+85ºC 
54HMCYB140T160G14~16FULL0.5201.3Counter Clockwise5*5-55~+85ºC 
55HMCTA160T180G16~18FULL0.5201.25clockwise5*5-55~+85ºC 
56HMCTB160T180G16~18FULL0.5201.25Counter Clockwise5*5-55~+85ºC 
57HMCYA160T180G16~18FULL0.5201.25clockwise5*5-55~+85ºC 
58HMCYB160T180G16~18FULL0.5201.25Counter Clockwise5*5-55~+85ºC 
59HMCTA140T180G14~18FULL0.5201.25clockwise5*5-55~+85ºC 
60HMCTB140T180G14~18FULL0.5201.25Counter Clockwise5*5-55~+85ºC 
61HMCYA140T180G14~18FULL0.5201.25clockwise5*5-55~+85ºC 
62HMCYB140T180G14~18FULL0.5201.25Counter Clockwise5*5-55~+85ºC 
63Ku-KHMCTA150T200G15~20FULL0.6181.3clockwise5*5-55~+85ºC 
64HMCTB150T200G15~20FULL0.6181.3Counter Clockwise5*5-55~+85ºC 
65HMCYA150T200G15~20FULL0.6181.3clockwise5*5-55~+85ºC 
66HMCYB150T200G15~20FULL0.6181.3Counter Clockwise5*5-55~+85ºC 
67KHMCTA180T220G18~22FULL0.5201.25clockwise4.5~4.5-55~+85ºC 
68HMCTB180T220G18~22FULL0.5201.25Counter Clockwise4.5~4.5-55~+85ºC 
69HMCTA180T240G18~24FULL0.6181.3clockwise4.5~4.5-55~+85ºC 
70HMCTB180T240G18~24FULL0.6181.3Counter Clockwise4.5~4.5-55~+85ºC 
71K-KaHMCTA240T280G24~28FULL0.7181.3clockwise4.5~4.5-55~+85ºC 
72HMCTB240T280G24~28FULL0.7181.3Counter Clockwise4.5~4.5-55~+85ºC 
73KaHMCTA280T320G28~32FULL0.8171.35clockwise3.5*3.5-55~+85ºC 
74HMCTB280T320G28~32FULL0.8171.35Counter Clockwise3.5*3.5-55~+85ºC 

 

 
Custom Design:
 
Applications:
 
Wireless Communication Base Station
 
Radar System
 
RF Circuit
 
Microwave Radio Systems
 
T/R Module
 
GPS
 
Cavity Filter
 
Public Address System Radio Transmitter
 
Satellite TV



 


Mounting instructions for microstrip Components:

Storage : Components must be kept in a dry and protected environment. (Such as nitrogen gas cabinet or drying cabinet).
Normal operation : In the purification environment, it is necessary to wear dust-free finger covers and use plastic head or bamboo tweezers to avoid colliding with the substrate and scratching the microstrip line during operation.
Cleaning treatment : The components can be cleaned in absolute ethanol, and can also be gently wiped with absolute ethanol cotton balls. It is strictly forbidden to clean in an ultrasonic cleaner.
Installation :
* Soldering process. The components installation is recommended to use the soldering material which melting temp. is ≤183 ºC. Such as solder paste Sn63Pb37 or solder sheet. Use the heating table for soldering. After the solder fully melted at 200ºC and remove the components. The continuous time should< 30 seconds.
* Adhesion process: Use less and smooth conducting resin. It is finished when conductive adhesive can be seen around the component after it is placed in the installation position and pressed tightly. The curing temperature is less than 140ºC for baking.
Port connection :
  • Bonding method: Gold bonding wire is recommended to use 25μm, thermosonic bonding temperature is 100 ~ 150ºC, spherical bonding wedge pressure is 30 ~ 55gf, shaped bonding wedge pressure is 15 ~ 25gf.
  • Tin soldering method: Place the box installed microstrip components on the 120 ºC heating box to preheat. It is recommended to use the soldering material which melting temp. is ≤183 ºC, preload the gold-plated copper foil connection line into a certain arc and lap coat the microstrip line with flux. Use the pointed soldering iron to solder the connection line in turn, soldering iron setting temperature is 210 ºC ~ 230 ºC,soldering time less than 2 seconds per time, solder as little as possible and keep solder joints smooth and round. Generally, we don't recommend soldering for lead wires.
Assembly diagram :
(1): The installation hole (slot) size of the components shall be controlled as follows: length x width x height.

(2): Unilateral assembly gap of components should be <0.05mm.

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