RF 5.5GHz to 6.5GHz Microstrip Isolator

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Min Order 10 Pieces
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Chengdu Hzbeat Electronic Technology Co., Ltd.

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HMITA55T65G
0.5
20.0
1.25
10*10(mm)
Product Description
Product description:



2.7 GHz to 32.0 GHz Microstrip Circulators
NumberWave bandModelFrequency(GHz)BW MaxInsertion loss(dB) MaxIsolation(dB)MaxVSWR MaxDirectionSize(mm)Operating temperature(ºC)
1SHMITA27T35G2.7~3.5FULL0.6201.3clockwise14*16-55~+85ºC
2HMITB27T35G2.7~3.5FULL0.6201.3Counter Clockwise14*16-55~+85ºC
3HMITA30T40G3~4FULL0.5181.3clockwise14*16-55~+85ºC
4HMITB30T40G3~4FULL0.5181.3Counter Clockwise14*16-55~+85ºC
5HMITA31T39G3.1~3.9FULL0.6181.3clockwise12*12-55~+85ºC
6HMITB31T39G3.1~3.9FULL0.6181.3Counter Clockwise12*12-55~+85ºC
7S-CHMITA34T45G3.4~4.5FULL0.6181.3clockwise12*12-55~+85ºC
8HMITB34T45G3.4~4.5FULL0.6181.3Counter Clockwise12*12-55~+85ºC
9HMITA35T55G3.5~5.5FULL0.6161.3clockwise14*16-55~+85ºC
10HMITB35T55G3.5~5.5FULL0.6161.3Counter Clockwise14*16-55~+85ºC
11CHMITA40T50G4~5FULL0.5201.25clockwise12*12-55~+85ºC
12HMITB40T50G4~5FULL0.5201.25Counter Clockwise12*12-55~+85ºC
13HMITA45T55G4.5~5.5FULL0.5201.25clockwise12*12-55~+85ºC
14HMITB45T55G4.5~5.5FULL0.5201.25Counter Clockwise12*12-55~+85ºC
15HMITA50T60G5~6FULL0.5201.25clockwise10*10-55~+85ºC
16HMITB50T60G5~6FULL0.5201.25Counter Clockwise10*10-55~+85ºC
17HMITA55T65G5.5~6.5FULL0.5201.25clockwise10*10-55~+85ºC
18HMITB55T65G5.5~6.5FULL0.5201.25Counter Clockwise10*10-55~+85ºC
19HMITA65T75G6.5~7.5FULL0.5201.25clockwise10*10-55~+85ºC
20HMITB65T75G6.5~7.5FULL0.5201.25Counter Clockwise10*10-55~+85ºC
21HMITA50T80G5~8FULL0.6181.3clockwise10*10-55~+85ºC
22HMITB50T80G5~8FULL0.6181.3Counter Clockwise10*10-55~+85ºC
23HMITA60T80G6~8FULL0.6181.3clockwise10*10-55~+85ºC
24HMITB60T80G6~8FULL0.6181.3Counter Clockwise10*10-55~+85ºC
25C-XHMITA70T95G7.0~9.5FULL0.6171.35clockwise7*8-55~+85ºC
26HMITB70T95G7.0~9.5FULL0.6171.35Counter Clockwise7*8-55~+85ºC
27HMITA75T95G7.5~9.5FULL0.6201.25clockwise7*8-55~+85ºC
28HMITB75T95G7.5~9.5FULL0.6201.25Counter Clockwise7*8-55~+85ºC
29C-KuHMIYA70T130G7~13FULL0.7161.35clockwise6*7.5-55~+85ºC
30HMIYB70T130G7~13FULL0.7161.35Counter Clockwise6*7.5-55~+85ºC
31XHMITA80T100G8~10FULL0.5201.25clockwise6*7-55~+85ºC
32HMITB80T100G8~10FULL0.5201.25Counter Clockwise6*7-55~+85ºC
33HMITA85T105G8.5~10.5FULL0.5201.25clockwise6*7-55~+85ºC
34HMITB85T105G8.5~10.5FULL0.5201.25Counter Clockwise6*7-55~+85ºC
35HMITA80T120G8~12FULL0.5181.3clockwise6.5*7.5-55~+85ºC
36HMITB80T120G8~12FULL0.5181.3Counter Clockwise6.5*7.5-55~+85ºC
37HMITA80T120G8~12FULL0.6181.35clockwise6*7-55~+85ºC
38HMITB80T120G8~12FULL0.6181.35Counter Clockwise6*7-55~+85ºC
39HMITA90T110G9~11FULL0.5201.25clockwise6*7-55~+85ºC
40HMITB90T110G9~11FULL0.5201.25Counter Clockwise6*7-55~+85ºC
41HMITA100T120G10~12FULL0.5201.25clockwise6*7-55~+85ºC
42HMITB100T120G10~12FULL0.5201.25Counter Clockwise6*7-55~+85ºC
43X-KuHMITA110T130G11~13FULL0.5201.25clockwise6*7-55~+85ºC
44HMITB110T130G11~13FULL0.5201.25Counter Clockwise6*7-55~+85ºC
45KuHMITA120T150G12~15FULL0.5181.3clockwise6*7-55~+85ºC
46HMITB120T150G12~15FULL0.5181.3Counter Clockwise6*7-55~+85ºC
47HMITA120T180G12~18FULL0.7161.4clockwise6*7-55~+85ºC
48HMITB120T180G12~18FULL0.7161.4Counter Clockwise6*7-55~+85ºC
49HMITA140T180G14~18FULL0.5201.25clockwise5*6-55~+85ºC
50HMITB140T180G14~18FULL0.5201.25Counter Clockwise5*6-55~+85ºC
51HMITA150T170G15~17FULL0.4521.51.17clockwise3.5*4.5-55~+85ºC
52HMITB150T170G15~17FULL0.4521.51.17Counter Clockwise3.5*4.5-55~+85ºC
53Ku-KHMITA150T200G15~20FULL0.6181.3clockwise5*6-55~+85ºC
54HMITB150T200G15~20FULL0.6181.3Counter Clockwise5*6-55~+85ºC
55KHMITA180T220G18~22FULL0.5201.25clockwise4.5*5.5-55~+85ºC
56HMITB180T220G18~22FULL0.5201.25Counter Clockwise4.5*5.5-55~+85ºC
57HMITA180T240G18~24FULL0.6181.3clockwise4.5*5.5-55~+85ºC
58HMITB180T240G18~24FULL0.6181.3Counter Clockwise4.5*5.5-55~+85ºC
59K-KaHMITA240T280G24~28FULL0.7181.3clockwise4.5*5.5-55~+85ºC
60HMITB240T280G24~28FULL0.7181.3Counter Clockwise4.5*5.5-55~+85ºC
61KaHMITA280T320G28~32FULL0.8171.35clockwise3.5*4.5-55~+85ºC
62HMITB280T320G28~32FULL0.8171.35Counter Clockwise3.5*4.5-55~+85ºC
 

 
Custom Design:
 
Applications:
 
Wireless Communication Base Station
 
Radar System
 
RF Circuit
 
Microwave Radio Systems
 
T/R Module
 
GPS
 
Cavity Filter
 
Public Address System Radio Transmitter
 
Satellite TV



 


Mounting instructions for microstrip Components:

Storage : Components must be kept in a dry and protected environment. (Such as nitrogen gas cabinet or drying cabinet).
Normal operation : In the purification environment, it is necessary to wear dust-free finger covers and use plastic head or bamboo tweezers to avoid colliding with the substrate and scratching the microstrip line during operation.
Cleaning treatment : The components can be cleaned in absolute ethanol, and can also be gently wiped with absolute ethanol cotton balls. It is strictly forbidden to clean in an ultrasonic cleaner.
Installation :
* Soldering process. The components installation is recommended to use the soldering material which melting temp. is ≤183 ºC. Such as solder paste Sn63Pb37 or solder sheet. Use the heating table for soldering. After the solder fully melted at 200ºC and remove the components. The continuous time should< 30 seconds.
* Adhesion process: Use less and smooth conducting resin. It is finished when conductive adhesive can be seen around the component after it is placed in the installation position and pressed tightly. The curing temperature is less than 140ºC for baking.
Port connection :
  • Bonding method: Gold bonding wire is recommended to use 25μm, thermosonic bonding temperature is 100 ~ 150ºC, spherical bonding wedge pressure is 30 ~ 55gf, shaped bonding wedge pressure is 15 ~ 25gf.
  • Tin soldering method: Place the box installed microstrip components on the 120 ºC heating box to preheat. It is recommended to use the soldering material which melting temp. is ≤183 ºC, preload the gold-plated copper foil connection line into a certain arc and lap coat the microstrip line with flux. Use the pointed soldering iron to solder the connection line in turn, soldering iron setting temperature is 210 ºC ~ 230 ºC,soldering time less than 2 seconds per time, solder as little as possible and keep solder joints smooth and round. Generally, we don't recommend soldering for lead wires.
Assembly diagram :
(1): The installation hole (slot) size of the components shall be controlled as follows: length x width x height.

(2): Unilateral assembly gap of components should be <0.05mm.

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