Audited Supplier
| Name | Tin Lead solder paste |
| Alloy | Sn/Pb50 |
| Package | 500g/bottle |
| Melting point | 138ºC |
| Particles | 25-45um(custom made) |
| Viscosity | 180±30Pa.S |
| Copper corrosion | Not happen |
The Sn/Pb50 Solder Paste is formulated with an equal mix of tin (Sn) and lead (Pb), providing a balanced solution for general soldering tasks requiring good wetting properties and a moderate melting point.
This eutectic composition ensures the solder paste melts and solidifies at a consistent temperature, reducing defects such as voids or uneven joints. It is ideal for applications that demand reliable thermal conductivity and mechanical strength, such as consumer electronics repair and assembly.
The paste's excellent flow characteristics facilitate smooth, efficient soldering, making it suitable for both automated and manual applications.
Each product undergoes rigorous testing to confirm its purity, composition, and efficacy, guaranteeing that our customers receive a reliable product tailored for high-performance soldering tasks. We also provide comprehensive technical support and customer service, ensuring our clients have access to expert advice and assistance whenever needed.
Our product comes in white cans, with a default weight of 500 grams, customizable to meet specific customer needs. Each can is labeled with essential details including the product model, alloy composition, batch number, and weight. Additionally, the solder paste label provides concise instructions for use, along with safety and health guidelines. "ZS.HX Zhongshi" is the proud registered trademark of our company.
Enhance your assembly efficiency with a paste that offers reduced voiding and strong, durable joints. Ideal for high-density PCBs, our solder paste maintains its integrity under rigorous conditions, ensuring that each application is precise and dependable.
For enhanced storage stability, store the solder paste in a cool environment at 5 ºC. When kept at room temperature of 25 ºC or in a controlled setting of 35 ºC, monitor the viscosity periodically over 180 days at 25 ºC and 90 days at 35 ºC, ensuring the increase in viscosity remains below 10%.
Regarding continuous printing stability, maintain the same solder paste for 8 hours of printing and assess the viscosity using a steel net. Continue this process after storage and repeat for 3 consecutive days. Consistent viscosity is confirmed after three days of ongoing printing.
Lead-free solder wire
Tin-lead solder wire
Solder bar
Our products are compliant with ROHS and REACH standards, having undergone rigorous testing and certification. With every order, we provide a corresponding SGS certificate along with a material safety data sheet. For further details on this product's MSDS, our sales team is available to assist you.
