Audited Supplier
C04
287~296°c
OEM, ODM
1-2 Weeks
RoHS, ISO 9001, ISO 14001, GB/T 29490
Air Freight
XianYi
Bulk, Waffle Box, Tape and Reel, Film-Wrap Package
Pb92.5Sn5Ag2.5 Preform
Guangzhou
7804190000
Product Description
Pb92.5Sn5Ag2.5 Solder Preforms
Features:
- High Lead content
- High melting temperature (287~296 ºC)
- Good mechanical property and wettability
- Excellent thermal fatigue performance
- High reliability supported by long-term data
Description:
Pb92.5Sn5Ag2.5 is a high melting temperature (287~296 ºC) low cost solder with good wettability, corrosion resistance and mechanical properties. High lead solders are irreplaceable in electronic packaging industry at present. High temperature reliability of solder joints can be increased by the addition of appropriate amount of silver to high lead solder, catering to the requirements of high power device packaging.
Solder Composition:
Physical Properties:
Method of Use:
Reflow Profile
Reflow profile of Pb92.5Sn5Ag2.5 Solder Preforms
(For reference only, the reflow profile should be adjusted according to the actual soldering situation)
Operation Details:
- Picking up:
Use an anti-static tools to pick up the solder to prevent solder contamination and deformation.
- Operating environment:
- Flux Compatibility:
Pb92.5Sn5Ag2.5 solder is compatible with regular no-clean and water-soluble electronic grade fluxes currently.
Dimension Tolerance:
Storage and Product Management:
- Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.
- Product management
Keep container tightly closed when product is not in use.
Safety:
- Please use this product with adequate ventilation and certain personal protection conditions.
- Please do not mix with other toxic chemicals.
List of Common Solders
*Note : In this table, "e" indicates eutectic alloys, "ne" indicates near eutectic alloys and "mp" indicates the melting point of simple substance. Other alloys can be customized for your requirement. For more details please contact us.
Features:
- High Lead content
- High melting temperature (287~296 ºC)
- Good mechanical property and wettability
- Excellent thermal fatigue performance
- High reliability supported by long-term data
Description:
Pb92.5Sn5Ag2.5 is a high melting temperature (287~296 ºC) low cost solder with good wettability, corrosion resistance and mechanical properties. High lead solders are irreplaceable in electronic packaging industry at present. High temperature reliability of solder joints can be increased by the addition of appropriate amount of silver to high lead solder, catering to the requirements of high power device packaging.
Solder Composition:
| Element | Wt% |
| Lead (Pb) | Margin |
| Tin (Sn) | 5.0 ± 0.5 |
| Silver (Ag) | 2.5 ± 0.2 |
Physical Properties:
| Product name | Melting point/ºC solid / liquid phase | Density g/cm3 | Resistivity µΩ·m | Thermal conductivity W/m·K | Thermal expansion coefficient 10-6/ºC | Tensile strength Mpa |
Pb92.5Sn5Ag2.5 | 287~296 | 11.02 | 0.2 | 26 | 29 | 29.03 |
Method of Use:
Reflow Profile
| Preheating stage | Heat preservation stage | Soldering stage | Cooling stage | |
| RT ~ 175 ºC | 175~ 287 ºC | 287 ~ 315 ºC | 287ºC ~ RT | |
| Heating rate | Time | Time | Time | Cooling rate |
| 1 ~ 3ºC/s | 60~ 110s | 150~ 220s | 40~ 60s | 3 ~ 5ºC/s |
Reflow profile of Pb92.5Sn5Ag2.5 Solder Preforms(For reference only, the reflow profile should be adjusted according to the actual soldering situation)
Operation Details:
- Picking up:
Use an anti-static tools to pick up the solder to prevent solder contamination and deformation.
- Operating environment:
| Atmosphere | Parameter requirements |
| N2 | Oxygen concentration(200~ 1000ppm) |
| Vacuum | Vacuum degree ≤ 2.0×10-3Pa |
- Flux Compatibility:
Pb92.5Sn5Ag2.5 solder is compatible with regular no-clean and water-soluble electronic grade fluxes currently.
Dimension Tolerance:
| Thickness(t) | Typical tolerances for length, width or diameter(L/W/D) | |
| t <0.40mm | ±0.02mm | |
| 0.40mm≤ t <1.00mm | ±0.03mm | |
| t ≥1.00mm | ±0.05mm | |
| Thickness(t) | Thickness (t) | |
| Conventional solder alloys | Indium alloy | |
| t<0.05mm | ±0.005mm | ±0.01mm |
| 0.05mm≤ t <0. 10mm | ±0.008mm | ±0.01mm |
| 0. 10mm≤ t <0.20mm | ±0.01mm | |
| 0.20mm≤ t <0.40mm | ±0.02mm | |
| 0.40mm≤ t <1.00mm | ±0.03mm | |
| t ≥1.00mm | ±5% | |
Storage and Product Management:
- Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.
- Product management
Keep container tightly closed when product is not in use.
Safety:
- Please use this product with adequate ventilation and certain personal protection conditions.
- Please do not mix with other toxic chemicals.
List of Common Solders| Category | Products | Solidus(ºC) | Liquidus(ºC) | Density (g/cm3) | Resistivity (μΩ·m) | Thermal Conductivity (W/m ·K) | CTE (10-6/ºC) | Tensile Strength (MPa) |
Solder Metal | In51Bi32.5Sn16.5 | / | 60(e) | 7.88 | 0.522 | / | 22 | 33.44 |
| In66.3Bi33.7 | / | 72(e) | 7.99 | / | / | / | / | |
| Bi50Pb28Sn22 | / | 100(e) | 9.44 | / | / | / | / | |
| In52Sn48 | / | 118(e) | 7.3 | 0. 147 | 34 | 20 | 12 | |
| In50Sn50 | 118 | 125 | 7.3 | 0. 147 | 34 | 20 | 11.86 | |
| Bi58Sn42 | / | 138(e) | 8.56 | 0.383 | 19 | 15 | 55. 16 | |
| Bi57Sn42Ag1 | 138 | 140 | 8.57 | / | / | / | / | |
| In97Ag3 | / | 143(e) | 7.38 | 0.075 | 73 | 22 | 5.5 | |
| Sn43Pb43Bi14 | 144 | 163 | 9.02 | / | / | 24 | 44. 1 | |
| In80Pb15Ag5 | 149 | 154 | 7.85 | 0. 133 | 43 | 28 | 17.58 | |
| Sn53Pb37Bi10 | 150 | 168 | 8.65 | / | / | / | / | |
| Sn70Pb18In12 | 154 | 167 | 7.79 | 0. 141 | 45 | 24 | 36.68 | |
| In100 | / | 157(mp) | 7.31 | 0.072 | 86 | 29 | 1.88 | |
| In70Pb30 | 165 | 175 | 8. 19 | 0. 195 | 38 | 28 | 23.79 | |
| In60Pb40 | 174 | 185 | 8.52 | 0.246 | 29 | 27 | 28.61 | |
| Sn77.2In20Ag2.8 | 175 | 187 | 7.25 | 0. 176 | 54 | 28 | 46.88 | |
| Sn62Pb36Ag2 | / | 179(e) | 8.42 | 0. 145 | 42 | 27 | 44 | |
| Sn63Pb37 | / | 183(e) | 8.4 | 0. 146 | 51 | 25 | 52 | |
| In50Pb50 | 184 | 210 | 8.86 | 0.287 | 22 | 27 | 32.2 | |
| Pb60In40 | 197 | 231 | 9.3 | 0.331 | 19 | 26 | 34.48 | |
| Sn86.9In10Ag3. 1 | 201 | 205 | 7.37 | / | / | / | / | |
| Au10Sn90 | / | 217(e) | 7.78 | / | / | / | 50.2 | |
| SAC387(Sn95.5Ag3.8Cu0.7) | / | 217(ne) | 7.4 | 0. 132 | 57 | 22 | 48 | |
| SAC305(Sn96.5Ag3.0Cu0.5) | 217 | 218 | 7.37 | 0. 132 | 58 | 21 | 50 | |
| Sn96.5Ag3.5 | / | 221(e) | 7.37 | 0. 108 | 33 | 30 | 39 | |
| Sn99.3Cu0.7 | / | 227(e) | 7.31 | / | / | / | / | |
| Sn100 | / | 232(mp) | 7.29 | 0. 111 | 73 | 24 | 13. 1 | |
| Sn65Ag25Sb10 | / | 233(e) | 7.8 | / | / | 36 | 117.2 | |
| Sn95Sb5 | 235 | 240 | 7.25 | 0. 145 | 28 | 31 | 40.7 | |
| Sn90Sb10 | 240 | 250 | 7.22 | / | 42 | 27 | 44 | |
| Pb75In25 | 240 | 260 | 9.97 | 0.375 | 18 | 26 | 37.58 | |
| Pb88Sn10Ag2 | 268 | 290 | 10.75 | 0.203 | 27 | 29 | 22.48 | |
| Pb90Sn10 | 275 | 302 | 10.75 | / | / | 24.6 | 32 | |
| Au80Sn20 | / | 280(e) | 14.52 | 0.224 | 57 | 16 | 276 | |
| Pb92.5Sn5Ag2.5 | 287 | 296 | 11.02 | 0.2 | 29 | 24 | 29.03 | |
| Pb90Sn5Ag3In2 | 294 | 297 | 10.89 | / | / | / | / | |
| Pb92.5In5Ag2.5 | 300 | 310 | 11.02 | 0.313 | 25 | 25 | 31.44 | |
| Au88Ge12 | / | 361(e) | 14.67 | 0. 151 | 44 | 13.4 | 185 | |
| Au96.8Si3.2 | / | 363(e) | 15.4 | / | 27 | 12 | 255 | |
| Au98Si2 | 363 | 390 | 16.92 | / | / | / | / | |
Brazing Metal | Ag60Cu30Sn10 | 600 | 720 | 9.58 | / | / | / | / |
| Ag72Cu28 | / | 780(e) | 10 | / | 352 | 17.8 | 250-360 | |
| Ag50Cu50 | 780 | 870 | 9.67 | / | / | / | / | |
| Au60Ag20Cu20 | 835 | 845 | 13.79 | / | / | / | / | |
| Ag92.5Cu7.5 | / | / | 10.37 | / | / | / | / | |
| Au80Cu20 | / | 910(e) | 15.67 | / | / | / | / | |
| Au50Cu50 | 955 | 970 | 12.22 | / | / | / | / | |
| Ag100 | / | 961(mp) | 10.49 | 0.0163 | 429 | / | 180 | |
| Au100 | / | 1064(mp) | 19.3 | 0.0221 | 318 | 14 | 138 | |
| Cu100 | / | 1083(mp) | 8.96 | 0.0172 | 401 | / | 246 |
