Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines

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Min Order 1 Piece
Shipping From Guangdong, China
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Shenzhen Ponda Grinding Technology Co.,Ltd.

VIP   Audited Supplier 4 years
Profile Certified by SGS/BV
FD-300QA
12months
12months
Surface Grinding Machine
Flat Workpieces
Grinding Wheel
Pcl
Semiautomatic
Surface Grinding Machine
High Precision
ISO 9001
New
Electricity
Grinding Disc
with Variable Speed
Semiconductor Material
Metal and Non-Metal
Reduction
Φ300
Oversea Setup & After-Sale Avalaible
Single Plate
3
Pneumatic or Weight Block
Metal & Non-Metal
Slurry
1000kg
PONDA
Wood Crate
China
Product Description
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Equipment structure
The equipment is mainly composed of frame, air spindle, porous ceramic suction cup (suitable for various types of ring), vacuum spindle deceleration motor, static pressure air suspension electric spindle, diamond grinding wheel, screw guide module, full closed-loop servo control system, cutting fluid circulation system, etc.

Products Show
Equipment features
1. The vacuum spindle is made of 603 stainless steel material, which is not easily affected by thermal expansion and leads to the precision of grinding size, and the bearing is made of well-known brands.
2. Vacuum suction cups are divided into microporous ceramic suction cups and special stainless steel gas slots, which can be selected according to product requirements.
3. The vacuum spindle is driven by precision reducer and servo motor.
4. The rotor of the static pressure gas suspension spindle adopts zirconia ceramic, which completely avoids the heat transmitted by the motor causing the gas film gap to be too large after the expansion of the floating rotor and reduces the rigidity of the spindle. The equipment using the spindle has high precision and good stability.
5. Screw guide module adopts high precision and high preloading type.
6. Full closed-loop grating control system: to ensure the servo motor to the precision of the grinding wheel feed monitoring and repair.
7. Grinding fluid circulation system: The grinding fluid in the production process continues to cool the workpiece, grinding wheel and electric spindle through the circulation system, and the grinding fluid can also improve the self-sharpness of the grinding wheel.

APPLICATION
Single
Plate
Lapping
& Polishing
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealingvalve and sealing ring(liquid, oil, gas)
SemiconductorLED substrate(Al2O3, Si, SiC)
wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
PlasticPE, E/VAC, SBS, SBR, NBR, SR, BR, PR
Phone Frame(flat)back plate
PCBadhesive, coating, circuit
Optics(flat)optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
Radaroxide coating plate
Gemstonejade, sapphire, agate, etc.
Othersgraphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.


SPECIFICATION 
Technical parameter
The size of the vacuum sucker is 300mm
Maximum processing size 300mm
Work plate speed (continuously adjustable) 0-300rpm/min
Wheel size 300mm(12 inches)
Grinding wheel spindle power7.5kw
Product processing thickness error ≤±0.003mm(medium 100mm)
Product processing flatness≤0.003mm(medium 100mm)
Feed repeated positioning accuracy0.001mm
Roughness Ras0.2
Vacuum negative pressure 20-90Kpa
Grinding modeWafer rotation, axial in-Feed grinding
Mode of operationSemi-automatic grinding method (manual loading and unloading)
Equipment dimensions1200*1100*2100mm
Weight  2350KG
Built-In Optional Kits
GradeStandardUpgradedAdvanced
ControlsDigitalDigitalTouch-Screen PLC
Pressure SourceHand Weight BlockPneumatic Weight Block
Manual
Pneumatic Press
Integrated with PLC
Slurry Supply System-ManualDigital, Manual
Cylinder Bar Drive System-ManualIntegrated with PLC
Conditioning Ring Drive System-ManualIntegrated with PLC
Machine Enclosure-Framed by Aluminum AlloyFramed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (SINGLE PLATE)



About the Company

Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials

Production and assembly shop
We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people

Patent

Delivery & Packing
Packing Details  : Packing, 1 pcs/carton.
Ceramic Chip High Speed Precise Lapping Machine

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

 

 

 

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