Audited Supplier
Ultra-fast pulsed picosecond laser with high peak power, stable and reliable
Self-developed cutting process technology patent, excellent kerf quality, no surface damage
High dimensional accuracy, small chipping, low thermal impact, excellent processing quality
Automatic loading and unloading, inspection, sorting and lobe functions
sapphire, digital 3D front and
back cover glass, various
optical glass, and filter glass
| echnical specification | |
| Cutting Laser | Picosecond 1064nm Laser |
| Lobe Laser | CO2 |
| Cutting Laser Power | 70W |
| Lobe Laser Power | 55W |
| Laser Life | >20000h |
| Platform Speed | 1000mm/s |
| Control System Software | Integrated vision, laser and motion |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
