To252 Sfs06r06df Vds-60V ID-210A RDS (ON) -6milliohm Qg-30nc N-Channel Power Mosfet

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Shanghai Winture Electric Co., Ltd.

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TO252 SFS06R06DF
RoHS, ISO
Metal Porcelain Tube
Sharp Cutoff Shielding Tube
Air Cooled Tube
Switch Transistor
High Frequency
Planar
Chip Transistor
High Power
Silicon
Orientalsemi
Carton
35x37x30cm
China
8541290000
Product Description

General Description

FSMOS® MOSFET is based on Oriental Semiconductor's unique device design to achieve low RDS(ON), low gate charge, fast switching and excellent avalanche characteristics. The low Vth series is specially designed to use in synchronous rectification power systems with low driving voltage.
 

Features

  • Low RDS(ON) & FOM
  • Extremely low switching loss
  • Excellent reliability and uniformity
  • Fast switching and soft recovery
 

Applications

  • PD charger
  • Motor driver
  • Switching voltage regulator
  • DC-DC convertor
  • Switched mode power supply
 

Key Performance Parameters

 
ParameterValueUnit
VDS, min @ Tj(max)60V
ID, pulse210A
RDS(ON) max @ VGS=10V6
Qg30nC


Marking Information

 
Product NamePackageMarking
SFS06R06DFTO252SFS06R06D

 
 
Absolute Maximum Ratings at Tj=25°C unless otherwise noted
ParameterSymbolValueUnit
Drain source voltageVDS60V
Gate source voltageVGS±20V
Continuous drain current1), TC=25 °CID70A
Pulsed drain current2), TC=25 °CID, pulse210A
Continuous diode forward current1), TC=25 °CIS70A
Diode pulsed current2), TC=25 °CIS, Pulse210A
Power dissipation3), TC=25 °CPD87W
Single pulsed avalanche energy5)EAS66mJ
Operation and storage temperatureTstg,Tj-55 to 150°C
 

Thermal Characteristics


Parameter

Symbol

Value

Unit
Thermal resistance, junction-caseRθJC1.44°C/W
Thermal resistance, junction-ambient4)RθJA62°C/W


Electrical Characteristics at Tj=25°C unless otherwise specified
ParameterSymbolMin.Typ.Max.UnitTest condition
Drain-source breakdown voltageBVDSS60  VVGS=0 V, ID=250 μA
Gate threshold voltageVGS(th)1.0 2.5VVDS=VGS, ID=250 μA
Drain-source
on-state resistance
RDS(ON) 4.76VGS=10 V, ID=20 A
Drain-source
on-state resistance
RDS(ON) 6.410VGS=4.5 V, ID=10 A
Gate-source leakage current
IGSS
  100
nA
VGS=20 V
  -100VGS=-20 V
Drain-source leakage currentIDSS  1μAVDS=60 V, VGS=0 V
Gate resistanceRG 2.8 Ωƒ=1 MHz, Open drain
 

Dynamic Characteristics

ParameterSymbolMin.Typ.Max.UnitTest condition
Input capacitanceCiss 2136 pF
VGS=0 V, VDS=50 V,
ƒ=100 kHz
Output capacitanceCoss 332 pF
Reverse transfer capacitanceCrss 10.6 pF
Turn-on delay timetd(on) 22.9 ns
VGS=10 V, VDS=50 V, RG=2 Ω, ID=25 A
Rise timetr 6.5 ns
Turn-off delay timetd(off) 45.7 ns
Fall timetf 20.4 ns


Gate Charge Characteristics
ParameterSymbolMin.Typ.Max.UnitTest condition
Total gate chargeQg 30 nC
VGS=10 V, VDS=50 V, ID=25 A
Gate-source chargeQgs 5.8 nC
Gate-drain chargeQgd 6.1 nC
Gate plateau voltageVplateau 3.6 V


Body Diode Characteristics
ParameterSymbolMin.Typ.Max.UnitTest condition
Diode forward voltageVSD  1.3VIS=20 A, VGS=0 V
Reverse recovery timetrr 50.3 ns
VR=50 V, IS=25 A,
di/dt=100 A/μs
Reverse recovery chargeQrr 45.1 nC
Peak reverse recovery currentIrrm 1.5 A

Note
  1. Calculated continuous current based on maximum allowable junction temperature.
  2. Repetitive rating; pulse width limited by max. junction temperature.
  3. Pd is based on max. junction temperature, using junction-case thermal resistance.
  4. The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with Ta=25 °C.

Product Information

ProductPackagePb FreeRoHSHalogen Free
SFS06R06DFTO252yesyesyes


 

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