Vienna Topology Vds, High Voltage Power Mosfet

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Shanghai Winture Electric Co., Ltd.

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OSG65R035HTF TO247
RoHS, ISO
Metal Porcelain Tube
Sharp Cutoff Shielding Tube
Air Cooled Tube
Switch Transistor
High Frequency
Planar
Plastic Sealed Transistor
Medium Power
Silicon
Extremely Low Switching Loss
Excellent Stability and Uniformity
PC Power
LED Lighting
Fast EV Charging Station
24 Months
Orientalsemiconductor
Carton
TO247
China
854129000
Product Description
Product Description

 


General Description
The GreenMOS® high voltage MOSFET utilizes charge balance technology to achieve outstanding low on-resistance and lower gate charge. It is engineered to minimize conduction loss, provide superior switching performance and robust avalanche capability.
The GreenMOS® Generic series is optimized for extreme switching performance to minimize switching loss. It is tailored for high power density applications to meet the highest efficiency standards.

Features                                                                                                  
  • Low RDS(on) & FOM
  • Extremely low switching loss
  • Excellent stability and uniformity

Applications
  • PC power
  • LED lighting
  • Telecom power
  • Server power
  • EV Charger
  • Solar/UPS
  •  
  • Key Performance Parameters
  •  
    ParameterValueUnit
    VDS, min @ Tj(max)700V
    ID, pulse240A
    RDS(ON) , max @ VGS=10V35
    Qg153.6nC

    Marking Information
     
    Product NamePackageMarking
    OSG65R035HTFTO247OSG65R035HT
Absolute Maximum Ratings at Tj=25°C unless otherwise noted
 
ParameterSymbolValueUnit
Drain-source voltageVDS650V
Gate-source voltageVGS±30V
Continuous drain current1), TC=25 °C
ID
80
A
Continuous drain current1), TC=100 °C50
Pulsed drain current2), TC=25 °CID, pulse240A
Continuous diode forward current1), TC=25 °CIS80A
Diode pulsed current2), TC=25 °CIS, pulse240A
Power dissipation3) TC=25 °CPD455W
Single pulsed avalanche energy5)EAS1700mJ
MOSFET dv/dt ruggedness, VDS=0…480 Vdv/dt50V/ns
Reverse diode dv/dt, VDS=0…480 V, ISD≤IDdv/dt15V/ns
Operation and storage temperatureTstg, Tj-55 to 150°C

Thermal Characteristics
 
ParameterSymbolValueUnit
Thermal resistance, junction-caseRθJC0.27°C/W
Thermal resistance, junction-ambient4)RθJA62°C/W

Electrical Characteristics at Tj=25°C unless otherwise specified
ParameterSymbolMin.Typ.Max.UnitTest condition

Drain-source breakdown voltage

BVDSS
650  
V
VGS=0 V, ID=2 mA
700  VGS=0 V, ID=2 mA, Tj=150 °C
Gate threshold voltageVGS(th)2.8 4.0VVDS=VGS, ID=2 mA

Drain-source on- state resistance

RDS(ON)
 0.0280.035
Ω
VGS=10 V, ID=40 A
 0.075 VGS=10 V, ID=40 A, Tj=150 °C
Gate-source leakage current
IGSS
  100
nA
VGS=30 V
  -100VGS=-30 V
Drain-source leakage currentIDSS  5μAVDS=650 V, VGS=0 V
Gate resistanceRG 2.4 Ωƒ= 1 MHz, Open drain

Dynamic Characteristics
ParameterSymbolMin.Typ.Max.UnitTest condition
Input capacitanceCiss 7549.2 pF
VGS=0 V, VDS=50 V,
ƒ=100 kHz
Output capacitanceCoss 447.1 pF
Reverse transfer capacitanceCrss 13.2 pF
Turn-on delay timetd(on) 52.3 ns
VGS=10 V, VDS=400 V, RG=5 Ω, ID=40 A
Rise timetr 86.8 ns
Turn-off delay timetd(off) 165.2 ns
Fall timetf 8.5 ns

Gate Charge Characteristics
ParameterSymbolMin.Typ.Max.UnitTest condition
Total gate chargeQg 153.6 nC

VGS=10 V, VDS=400 V, ID=40 A
Gate-source chargeQgs 41.8 nC
Gate-drain chargeQgd 50.2 nC
Gate plateau voltageVplateau 5.8 V

Body Diode Characteristics
ParameterSymbolMin.Typ.Max.UnitTest condition
Diode forward voltageVSD  1.3VIS=80 A, VGS=0 V
Reverse recovery timetrr 566.1 nsVR=400V,
IS=40 A,
di/dt=100 A/μs
Reverse recovery chargeQrr 13.2 μC
Peak reverse recovery currentIrrm 45.9 A

Note
  1. Calculated continuous current based on maximum allowable junction temperature.
  2. Repetitive rating; pulse width limited by max. junction temperature.
  3. Pd is based on max. junction temperature, using junction-case thermal resistance.
  4. The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with Ta=25 °C.
  5. VDD=100 V, VGS=10 V, L=60 mH, starting Tj=25 °C.
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