a Multi-Purpose 3D Surface Ceramic Cover Sweeping Machine Equipped with Computer Setting Frequency Conversion

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Shipping From Guangdong, China
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Shenzhen Ponda Grinding Technology Co.,Ltd.

VIP   Audited Supplier 4 years
Profile Certified by SGS/BV
FD42010A-3D
12months
12months
Surface Grinding Machine
Flat Workpieces
Grinding Wheel
PLC
Semiautomatic
Surface Grinding Machine
High Precision
ISO 9001
New
Electricity
Grinding Disc
with Variable Speed
Lapping Machine
Grinding Industry
Metal and Non-Metal
Φ910mm
Oversea Setup & After-Sale Avalaible
Single Plate
3
Pneumatic or Weight Block
Metal & Non-Metal
Slurry
ISO 9001
PONDA
Wood Crate
1200*1800*2300mm
China
Product Description
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Scope of application:
Widely used in 3D ceramic surface, LED sapphire substrate, optical glass wafer, wafer, mold, stainless steel, zinc alloy and other materials 3D surface, 2.5D surface polishing.
 Products Show
Equipment advantages:
1. The rotation of the grinding disc can ensure the uniformity and symmetry of the swept products, effectively reduce scratches and repair scratches.
2. With dual structure of A and B disks, when A disks work, B disks can be loaded and unloaded, and A and B disks can set parameters independently, which can effectively improve work efficiency.
3. The upper plate can be accurately polished for 2.5D, 3D ceramic cover plate and key hole with carpet or brush, and it is multi-purpose
(with computer setting frequency conversion).

APPLICATION
ProcessIndustry by SubstanceIndustry by Applicability
Single
Plate
Lapping
& Polishing
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealingvalve and sealing ring(liquid, oil, gas)
SemiconductorLED substrate(Al2O3, Si, SiC)
wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
PlasticPE, E/VAC, SBS, SBR, NBR, SR, BR, PR
Phone Frame(flat)back plate
PCBadhesive, coating, circuit
Optics(flat)optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
Radaroxide coating plate
Gemstonejade, sapphire, agate, etc.
Othersgraphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.

SPECIFICATION 
Standard Specification
Workpiece disc diameterΦ 420 mm
Number of workpieces10 (2 digits)
Brush disc diameterΦ 460 mm
Number of brush trays10
Workpiece disk speed0-60RPM
Brush disk speed0-300RPM
Work disk powerTwo 5.5KW three-phase 380v
Brush disk powerFour 2.2KW three-phase 380v
Lift servo motor power:2 units 1KW
Displacement motor power:0.75 KW
Working air pressure0.4-0.6 MPa
Machine weight:2700kg
Dimensions (L*W*H)2510*1860*2170mm
Built-In Optional Kits
GradeStandardUpgradedAdvanced
ControlsDigitalDigitalTouch-Screen PLC
Pressure SourceHand Weight BlockPneumatic Weight Block
Manual
Pneumatic Press
Integrated with PLC
Slurry Supply System-ManualDigital, Manual
Cylinder Bar Drive System-ManualIntegrated with PLC
Conditioning Ring Drive System-ManualIntegrated with PLC
Machine Enclosure-Framed by Aluminum AlloyFramed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.


SAMPLE DEMONSTRATION (SINGLE PLATE)



Patent

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing
Packing Details  : Packing, 1 pcs/carton.


FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

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