Jiangsu Himalaya Semiconductor Co., Ltd.  

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in exporting business and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers! We manufacture equipments for Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting(Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si /Sic Wafe, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine(Wafer Packaging)), Automatic Silicone Dispensing Equipment. As well as we provide some solutions for handling exhausted metal sorter equipments, customized coating and plating machine, TGV & manual/semiautomatic/automatic equipments, so on.

Why Choose Us

Main Products: Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, ...
Year of Establishment: 2019-09-12
Repeat Buyers Choice: 80%~100%
Address: Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital: 100,000,000 RMB
Main Markets: Europe
Supply Chain Partners: 30
Minimum Order Quantity: 1 Set
International Commercial Terms(Incoterms): FOB, CIF, CFR, EXW
Terms of Payment: LC, T/T, PayPal, Western Union
Average Lead Time: Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months
Export Year: 5 Years
Nearest Port: Shenzhen Port
Inspection Type for Finished Products: 100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished Products: Finished product checked by packing staff
Traceability of Raw Materials: No
ODM Service Available: Yes
OEM Service Available: Yes
Customization Options: Flexible customization