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Audited Supplier
2 Years
Jiangsu Himalaya Semiconductor Co., Ltd.
Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
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High Precision Vacuum Plasma Cleaning Machine Omnidirectional Surface Cleaning for Semiconductor
$
1000000.00
MOQ:1
Xy Axis Carbon Dioxide Marking Machine
$
100000.00
MOQ:1
High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device
$
0.00
MOQ:1
Automatic CCD Visual Glue Dispenser Machine Semiautomatic Three-Axis Desktop Dispensing Robot Equipment Factory
$
0.00
MOQ:1
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
$
1000000.00
MOQ:1
High-Precision 3D Systems Mjp Jewelry Wax Model 3D Printer
$
100000.00
MOQ:1
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Audited Supplier2 Years
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