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Audited Supplier
2 Years
Jiangsu Himalaya Semiconductor Co., Ltd.
Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
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Jiangsu Himalaya Semiconductor Co., Ltd.
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CCD Visual Spray Dispenser SMT Glue Dispensing Machine LED Package Industrial Equipment
$
0.00
MOQ:1
High Precision Machining and Consistency Wafer Laser Scribing / Cutting Equipment
$
1000000.00
MOQ:1
Da1201FC Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA
$
0.00
MOQ:1
High Precision Pick and Place Machine Flip Chip Die Bonder Semiconductor Bonding Equipment
$
1000000.00
MOQ:1
Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine
$
1000000.00
MOQ:1
Desktop Type Dispensing Machine Silicone Glue Three Axis Needle Valve Dispensing
$
200000.00
MOQ:1
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