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Audited Supplier
2 Years
Jiangsu Himalaya Semiconductor Co., Ltd.
Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
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Fiber Laser Engraving Machine Laser for Marking of Curved Surface, Relief, Irregular Product
$
7000.00
MOQ:1
Green Laser Marking Machine on Mobile Digital Products/Copper Foil/FPC Steel Sheet/Pi/Cvl/Barcode/Qr Codel
$
0.00
MOQ:1
Power Blade Series Ideal Choice for Complex Surface Measurement Rema Series
$
1800000.00
MOQ:1
Performance High Efficiency PCB/FPC/RF/Touchid/Type-C/TF-Card/LGA/BGA Module Laser Cutting Machine
$
1000000.00
MOQ:1
Gears / Shafts / Bearings / Clutch / Metal Fiber Laser Marking Machine
$
0.00
MOQ:1
Substrate Display Glass C500 Semiconductor Equipment Is Mainly Used in Display Industry
$
3000000.00
MOQ:1
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Audited Supplier2 Years
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