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Audited Supplier
4 Years
Shenzhen Ponda Grinding Technology Co.,Ltd.
Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder,Single Plate Lapping & Polishing Machine,Double Plate Lapping & Polishing Machine,Lapping & CMP Systm,Abrasive Tools & Consumables.
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Shenzhen Ponda Grinding Technology Co.,Ltd.
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a Multi-Purpose 3D Surface Ceramic Cover Sweeping Machine Equipped with Computer Setting Frequency Conversion
$
240000.00
MOQ:1
Valve Plate and Other High-Precision Large Workpiece Single-Side Polishing Machine
$
20000.00
MOQ:1
Floor Type Double Side Grinding Machine with Less Equipment Failure and No Damage to Workpiece
$
50000.00
MOQ:1
Shenzhen Ponda Silicon Wafer Semiconductor Single - Side Grinding Equipment
$
20000.00
MOQ:1
New-Type Customized China High Precision Planar Single Sided Grinding and Polishing Machine
$
20000.00
MOQ:1
Fd-6bl Hard Alloy Double-Sided Lapping Machine/Polishing Machine
$
50000.00
MOQ:1
Transverse Wafer Grinder Thinning Polishing
$
60000.00
MOQ:1
Fd3803p Optical Glass Plane Polishing Machine
$
240000.00
MOQ:1
The High Efficiency and Fast Vertical Thinning Machine Is Suitable for The Thinning of Various Metal Materials
$
60000.00
MOQ:1
Automatic Metal Precision Grinder Manufacturer
$
20000.00
MOQ:1
Small Precision Single-Sided Grinding Machine for Various Materials
$
20000.00
MOQ:1
Professional Custom Mold Polishing Single-Side Grinding Polishing Equipment
$
240000.00
MOQ:1
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