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Audited Supplier2 Years

Jiangsu Himalaya Semiconductor Co., Ltd.

Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

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MadeInChina.com > Jiangsu Himalaya Semiconductor Co., Ltd. > Product

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Image	Product	Sales
	High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach $1000000.00	MOQ:1
	20W Fiber Laser Marking Machine Price for Metal, Steel, Iron, Aluminum, PVC, Keyboard, Bearings Engraving $7000.00	MOQ:1
	High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device $1000000.00	MOQ:1
	High Precision FPC Package Dispenser Machine Automatic Silicone Wafer Equipment Factory $0.00	MOQ:1
	High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board $500000.00	MOQ:1
	Higher Accuracy Wire Bonding/Welding Machine for to, Sot, Sop, Ssop, Tssop, Solc, Qfp, DIP, BGA, COB $170000.00	MOQ:1

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