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Guangzhou Xianyi Electronic Technology Co., Ltd.  

Solder Preform, Brazing Preform, Solder Paste, Ausn Solder Seal Lid, Nano-AG Paste, Flux, Ausn Solder Preform, Ausn Solder Paste, Heatsink Submount, Amb Ceramic Substrate
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Solder Preform In97AG3 for Low Temperature Lead-Free Solder in Indium-Silver Preform $3.00MOQ:1000
Flux-Coated Solder Preforms for Simplified Soldering Process in Uniform Flux Coating $3.00MOQ:1000
Gold-Tin Solder Seal Lids for Simplified Packaging Process in Ausn Hermetic Packaging System $3.00MOQ:1000
Solder Paste Au80sn20 for Printing and Dispensing Process Under Gold-Tin Eutectic Solder Alloy $250.00MOQ:2
Solder Paste Au78sn22 for Printing and Dispensing Process Under Gold-Tin Eutectic Solder Alloy $250.00MOQ:2
Gold-Tin Thin-Film Heatsink Submount for Laser Diode, Power Semiconductor with Ausn Layer $3.00MOQ:1000
Solder Preform Sn63pb37 for Aerospace Electronic Assembly in Lead-Containing Solder $3.00MOQ:1000
Solder Preforms Au80sn20 for Laser Diode Packaging with Gold-Tin Solder $3.00MOQ:1000
Solder Paste SAC305 for Electronic Brazing Under Sn96.5AG3cu0.5 Tin-Silver-Copper Solder Alloy $60.00MOQ:5
Solder Preforms Sac305 for Power Electronics Applications Sn96.5AG3.0cu0.5 $3.00MOQ:1000
Solder Preform Ag72Cu28 for Electronic Assembly in Silver-Copper Soldering $3.00MOQ:1000
Solder Preform Bi57Sn42Ag1 for Low Temperature Microelectronic Packaging Assembly $3.00MOQ:1000
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