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China Custom Made CPU Mainboard Bare Printed Circuit Board and PCBA

2025-04-09 2240

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Product Specifications

Model NO.:

PCB-Y-175

Structure:

Multilayer Rigid PCB

Dielectric:

FR-4

Material:

Epoxy Resin

Application:

Communication

Flame Retardant Properties:

V0

Processing Technology:

Electrolytic Foil

Production Process:

Immersion Gold

Base Material:

S1000-2m/It180A

Layers:

10L

Board Thickness:

1.6mm

Copper Thickness:

1.5oz

Test:

Flying Probe & Fixture

Solder Mask Type:

Black

Silkscreen Type:

White

Min.Line Width/Space:

0.1mm

Min. Hole Size:

0.2mm

Surface Finish:

Enig 2u"

X-Outs Allowed:

Not Allowed

Standard:

Ipcii Class 2

Certification:

RoHS, CCC, ISO, EPA

Customized:

Customized

Transport Package:

Bubble Pack+Aluminum Foil Pack

Specification:

65.5mm*24.5mm

Origin:

China

HS Code:

853400900

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