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Product Specifications

Type:

Rigid Circuit Board

Dielectric:

FR-4

Material:

Fiberglass Epoxy Resin + Polyimide Resin

Application:

Consumer Electronics

Flame Retardant Properties:

V2

Mechanical Rigid:

Rigid

Processing Technology:

Electrolytic Foil

Base Material:

Copper

Insulation Materials:

Epoxy Resin

Brand:

New Chip

Capacity:

1000000

OEM/ODM:

Available

Sample:

Available

Surface Treatment:

OSP, Enig, HASL, AG Immersion

Certificate Gurantee:

Yes

Test:

100%E-Testing

Min Bonding Pad Diameter:

10mil

Min Thickness of Soldermask:

10um

Color of Silk-Screen:

White, Yellow, Black

Data File Format:

Gerber File and Drilling File, Protel Series,...

Material for PCB:

Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari

Layer Count:

1-20 Layers

Shipping:

DHL/UPS/FedEx/Air/Sea

Trademark:

New Chip

Transport Package:

Foam Packing

Specification:

FR4 1-4 Layers

Origin:

China

HS Code:

8534009000

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