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dB100 Series High Precisiondie Bonding System

Name: dB100 Series High Precisiondie Bonding System
Uploaded: 2025-03-21T06:27:06+08:00

2025-04-09 3220IP Unknown

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Product Specifications

Model NO.:

DB100

After-sales Service:

Online and Video Service

Condition:

New

Speed:

Medium Speed

Precision:

High Precision

Certification:

ISO, CE

Warranty:

12 Months

Automatic Grade:

Semiautomatic

Type:

Medium-speed Chip Mounter

Max. Chip Size:

Smaller 20mm X20mm(50*50mm Optional)

Min. Chip Size:

0.2*0.2mm

Mounting Precision:

±3um 3δ

Feeding Mode:

2 Inch Waffle Box*2

Substrate Size:

150*150mm

X Y Z Axis Motion System:

Roller Screw + Servo Motor

X Y Axis Resolution:

0.1um

Power Supply:

220V, 50Hz

Net Weight:

150kg

Trademark:

TERMWAY

Transport Package:

Polywood Case

Specification:

800 * 750 * 630mm

Origin:

Beijing, China

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