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VIP   Audited Supplier2 Years

Jiangsu Himalaya Semiconductor Co., Ltd.  

Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
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High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach $1000000.00MOQ:1
20W Fiber Laser Marking Machine Price for Metal, Steel, Iron, Aluminum, PVC, Keyboard, Bearings Engraving $7000.00MOQ:1
High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device $1000000.00MOQ:1
High Precision FPC Package Dispenser Machine Automatic Silicone Wafer Equipment Factory $0.00MOQ:1
High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board $500000.00MOQ:1
Higher Accuracy Wire Bonding/Welding Machine for to, Sot, Sop, Ssop, Tssop, Solc, Qfp, DIP, BGA, COB $170000.00MOQ:1
High Precision Vacuum Plasma Cleaning Machine Omnidirectional Surface Cleaning for Semiconductor $1000000.00MOQ:1
Xy Axis Carbon Dioxide Marking Machine $100000.00MOQ:1
High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device $0.00MOQ:1
Automatic CCD Visual Glue Dispenser Machine Semiautomatic Three-Axis Desktop Dispensing Robot Equipment Factory $0.00MOQ:1
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device $1000000.00MOQ:1
High-Precision 3D Systems Mjp Jewelry Wax Model 3D Printer $100000.00MOQ:1
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