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VIP   Audited Supplier2 Years

Jiangsu Himalaya Semiconductor Co., Ltd.  

Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
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Stable and Reliable Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power $1000000.00MOQ:1
Vertical Electric Furnace 5g Ceramic Filter High-Temperature Box Furnace $200000.00MOQ:1
MLC600 Maskless Lithography System Aligner Machine with 3D Structure Lithography Capability $1000000.00MOQ:1
High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine $0.00MOQ:1
Direct Imaging Lithography Machine with Advanced Air Float Platform Technology $1000000.00MOQ:1
Laser Cutting Machine for PCB Printed Circuit Board Flex PCB Laser Cutting $0.00MOQ:1
Engraving Marker Logo Fiber Laser Marking Machine $0.00MOQ:1
High Quality Ion Implanter Semiconductor Material Small Implanter $0.00MOQ:1
Fully Automatic Semiconductor Glue Coating and Developing Equipment $0.00MOQ:1
High Precision Lab Universal Length Measuring Machine $1000000.00MOQ:1
Glass Substrate Laser Induced Drilling Machine Customized Picosecond/Femtosecond Laser $1000000.00MOQ:1
Semiconductor Automatic Chip Laying Machine for Semiconductor IC Packaging Production $1000000.00MOQ:1
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