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VIP   Audited Supplier2 Years

Jiangsu Himalaya Semiconductor Co., Ltd.  

Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
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CCD Visual Spray Dispenser SMT Glue Dispensing Machine LED Package Industrial Equipment $0.00MOQ:1
High Precision Machining and Consistency Wafer Laser Scribing / Cutting Equipment $1000000.00MOQ:1
Da1201FC Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA $0.00MOQ:1
High Precision Pick and Place Machine Flip Chip Die Bonder Semiconductor Bonding Equipment $1000000.00MOQ:1
Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine $1000000.00MOQ:1
Desktop Type Dispensing Machine Silicone Glue Three Axis Needle Valve Dispensing $200000.00MOQ:1
Intelligent Logistics Warehousing System Device Vertical Carousel Equipment Manufacturer $0.00MOQ:1
Integrated Human-Machine Operating System Fully Automatic Oxidation Diffusion Lpcvd Furnace $1000000.00MOQ:1
High Resolution Optical Lens Improves Line Quality Wafer Bonding Machine $1000000.00MOQ:1
Semiconductor Industry Wafer ID Marking Equipment with Fully Automatic Visual Positioning $0.00MOQ:1
Remove Dust/Oil/Fine Cleaning/Static Electricity Plasma Cleaning Equipment $1000000.00MOQ:1
20/30/50W Air Cooling Fiber Laser Marking Machine for Metal Mould Industry $0.00MOQ:1
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