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VIP   Audited Supplier2 Years

Jiangsu Himalaya Semiconductor Co., Ltd.  

Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
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Fiber Laser Engraving Machine Laser for Marking of Curved Surface, Relief, Irregular Product $7000.00MOQ:1
Green Laser Marking Machine on Mobile Digital Products/Copper Foil/FPC Steel Sheet/Pi/Cvl/Barcode/Qr Codel $0.00MOQ:1
Power Blade Series Ideal Choice for Complex Surface Measurement Rema Series $1800000.00MOQ:1
Performance High Efficiency PCB/FPC/RF/Touchid/Type-C/TF-Card/LGA/BGA Module Laser Cutting Machine $1000000.00MOQ:1
Gears / Shafts / Bearings / Clutch / Metal Fiber Laser Marking Machine $0.00MOQ:1
Substrate Display Glass C500 Semiconductor Equipment Is Mainly Used in Display Industry $3000000.00MOQ:1
High Precision Eutectic Wafer Bonder Chip Bonding Equipment with Die Attach System $1000000.00MOQ:1
Double Drive Longmen Interactive Fiber Laser Cutting Equipment for Sheet Metal Case Cabinets/Lighting Advertising $1000000.00MOQ:1
Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine / Die Attach $1000000.00MOQ:1
Large-Screen LCD Instrument High Temperature Vacuum Oven for Electronics/Aerospace/Military Weapons/Pharmaceuticals $1000000.00MOQ:1
Copper Slurry Thick Film Circuit Sintering Furnace with Rapid Control Response $1000000.00MOQ:1
Manufacture High Efficiency Laser Glue Removal and Repair Machine with Visual Positioning $1000000.00MOQ:1
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