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Alumina / Aluminum Nitride / Silicon Nitride Directed Plated Copper Dpc Substrate

Name: Alumina / Aluminum Nitride / Silicon Nitride Directed Plated Copper Dpc Substrate
Uploaded: 2025-03-17T08:25:38+08:00

2025-04-09 2590IP Unknown

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Product Specifications

Model NO.:

INC-DBC20310

Application:

Aerospace, Electronics, Medical, Vacuum Brazing

Compressive Strength:

2300MPa

Coating Thickness:

8-30μm

Coating Layer:

Mo/Mn

Plated Layer:

Nickel/Copper/Gold

Thermal Conductivity:

25W/(M.K)

Plating Thickness:

2-9μm

Max. Use Temperature:

1600ºC

Density:

3.7g/cm3

Type:

Insulating Ceramics

Trademark:

INNOVACERA

Transport Package:

Carton Packing

Specification:

Customized

Origin:

Fujian, China

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