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Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate for for Peltier Module and Semiconductors

2025-04-09 3810

  • Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate for for Peltier Module and Semiconductors

  • 381 views

Product Specifications

INC-DBC20310
Semiconductors, Aerospace, Electronics, Medical, Vacuum Brazing
2300MPa
8-30μm
Mo/Mn
Nickel/Copper/Gold etc.
25W/(M.K)
2-9μm
1600ºC
3.7g/cm3
Alumina, Al2O3
High Insulation
Insulating Ceramics
INNOVACERA
Customized
Fujian, China
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